Inventor · disambiguated record
Kazumasa Tanida
Also filed as: TANIDA KAZUMASA
53 granted patents·10 pending applications·449 citations·filing 2003–2023
98Inventor score
Top patents by PatentIndex Score
63 records- 0196US7598613B2Flip chip bonding structureROHM CO LTD·Filed 2005·Granted Oct 6, 2009·44 cites·5 claims
- 0295US9679867B2Semiconductor device having a low-adhesive bond substrate pairTOSHIBA KK·Filed 2015·Granted Jun 13, 2017·15 cites·10 claims
- 0395US7259454B2Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor deviceTOSHIBA KK·Filed 2005·Granted Aug 21, 2007·37 cites·2 claims
- 0494US10090351B2Semiconductor device having gaps within the conductive partsTOSHIBA MEMORY CORP·Filed 2017·Granted Oct 2, 2018·11 cites·23 claims
- 0594US7253527B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Aug 7, 2007·34 cites·7 claims
- 0692US7432196B2Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor deviceROHM CO LTD·Filed 2006·Granted Oct 7, 2008·23 cites·8 claims
- 0791US7808064B2Semiconductor package including through-hole electrode and light-transmitting substrateTOSHIBA KK·Filed 2009·Granted Oct 5, 2010·26 cites·18 claims
- 0890US9761463B2Semiconductor device and semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Sep 12, 2017·9 cites·11 claims
- 0990US9165962B2Solid state imaging deviceTOSHIBA KK·Filed 2013·Granted Oct 20, 2015·6 cites·6 claims
- 1090US7282444B2Semiconductor chip and manufacturing method for the same, and semiconductor deviceTOSHIBA KK·Filed 2004·Granted Oct 16, 2007·62 cites·24 claims
- 1189US11842972B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2022·Granted Dec 12, 2023·1 cites·14 claims
- 1286US2024055384A1Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2023·Application pending·0 cites
- 1385US8822307B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodYAMAGUCHI NAOKO·Filed 2012·Granted Sep 2, 2014·10 cites·10 claims
- 1483US8778778B2Manufacturing method of semiconductor device, semiconductor substrate, and camera moduleTANIDA KAZUMASA·Filed 2011·Granted Jul 15, 2014·8 cites·7 claims
- 1583US8338904B2Semiconductor device and method for manufacturing the sameTANIDA KAZUMASA·Filed 2010·Granted Dec 25, 2012·3 cites·11 claims
- 1682US7122457B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceROHM CO LTD·Filed 2004·Granted Oct 17, 2006·30 cites·8 claims
- 1780US8228426B2Semiconductor package and camera moduleMATSUO MIE·Filed 2009·Granted Jul 24, 2012·10 cites·15 claims
- 1879US7456502B2Wiring board with connection electrode formed in opening and semiconductor device using the sameROHM CO LTD·Filed 2005·Granted Nov 25, 2008·7 cites·2 claims
- 1979US6995455B2Semiconductor deviceROHM CO LTD·Filed 2003·Granted Feb 7, 2006·24 cites·14 claims
- 2076US11355462B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·11 claims
- 2176US7638421B2Manufacturing method for semiconductor device and semiconductor deviceROHM CO LTD·Filed 2007·Granted Dec 29, 2009·6 cites·9 claims
- 2276US7416963B2Manufacturing method of semiconductor deviceUMEMOTO MITSUO·Filed 2005·Granted Aug 26, 2008·9 cites·14 claims
- 2374US8405227B2Semiconductor device with a semiconductor chip connected in a flip chip mannerTANIDA KAZUMASA·Filed 2005·Granted Mar 26, 2013·3 cites·18 claims
- 2474US8063462B2Semiconductor device and method of manufacturing the sameTANIDA KAZUMASA·Filed 2008·Granted Nov 22, 2011·6 cites·17 claims
- 2572US8426977B2Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera moduleTANIDA KAZUMASA·Filed 2009·Granted Apr 23, 2013·5 cites·12 claims
- 2672US7888760B2Solid state imaging device and method for manufacturing same, and solid state imaging moduleTOSHIBA KK·Filed 2008·Granted Feb 15, 2011·5 cites·26 claims
- 2771US8704337B2Semiconductor device and method for manufacturing the sameTAKANO EIJI·Filed 2010·Granted Apr 22, 2014·3 cites·13 claims
- 2870US8748316B2Method of manufacturing semiconductor device, semiconductor device, and camera moduleSHIRONO TAKASHI·Filed 2011·Granted Jun 10, 2014·1 cites·7 claims
- 2969US10818628B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
- 3069US9935232B2Method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Apr 3, 2018·2 cites·17 claims
- 3169US7405485B2Semiconductor deviceROHM CO LTD·Filed 2005·Granted Jul 29, 2008·4 cites·9 claims
- 3269US7227262B2Manufacturing method for semiconductor device and semiconductor deviceSANYO ELECTRIC CO·Filed 2004·Granted Jun 5, 2007·13 cites·1 claims
- 3368US8269315B2Semiconductor device and method of manufacturing semiconductor deviceTANIDA KAZUMASA·Filed 2008·Granted Sep 18, 2012·4 cites·2 claims
- 3467US8552545B2Manufacturing method for semiconductor device, semiconductor device and semiconductor chipTANIDA KAZUMASA·Filed 2005·Granted Oct 8, 2013·3 cites·11 claims
- 3567US7452751B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Nov 18, 2008·3 cites·6 claims
- 3666US8980671B2Semiconductor device and manufacturing method of semiconductor deviceHONGO SATOSHI·Filed 2012·Granted Mar 17, 2015·3 cites·11 claims
- 3766US8237285B2Semiconductor device, through hole having expansion portion and thin insulating filmTANIDA KAZUMASA·Filed 2009·Granted Aug 7, 2012·3 cites·11 claims
- 3866US7235428B2Semiconductor device production methodROHM CO LTD·Filed 2003·Granted Jun 26, 2007·11 cites·14 claims
- 3963US10522494B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·13 claims
- 4063US9831204B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·13 claims
- 4163US8089163B2Semiconductor device production method and semiconductor deviceTANIDA KAZUMASA·Filed 2006·Granted Jan 3, 2012·2 cites·15 claims
- 4261US9117774B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·30 claims
- 4360US7306972B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 11, 2007·1 cites·5 claims
- 4459US9721865B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·28 claims
- 4559US8754535B2Semiconductor device with a semiconductor chip connected in a flip chip mannerROHM CO LTD·Filed 2013·Granted Jun 17, 2014·0 cites·32 claims
- 4659US8309430B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodTANIDA KAZUMASA·Filed 2011·Granted Nov 13, 2012·1 cites·20 claims
- 4758US7928581B2Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the sameROHM CO LTD·Filed 2005·Granted Apr 19, 2011·1 cites·70 claims
- 4851US8609511B2Semiconductor device manufacturing method, semiconductor device, and camera moduleSHIRONO TAKASHI·Filed 2011·Granted Dec 17, 2013·0 cites·7 claims
- 4951US2013062737A1Semiconductor device and manufacturing method of the sameHONGO SATOSHI·Filed 2012·Application pending·0 cites
- 5050US11553118B2Imaging apparatus, manufacturing method therefor, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 10, 2023·0 cites·20 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →