Inventor · disambiguated record
Takahiro Hakamata
Also filed as: HAKAMATA Takahiro
8 granted patents·1 pending application·342 citations·filing 2016–2022
84Inventor score
Files withTOKYO ELECTRON LTD9
Top patents by PatentIndex Score
9 records- 0195US10361366B2Resistive random accress memory containing a conformal titanium aluminum carbide film and method of makingTOKYO ELECTRON LTD·Filed 2018·Granted Jul 23, 2019·324 cites·20 claims
- 0294US10378105B2Selective deposition with surface treatmentTOKYO ELECTRON LTD·Filed 2017·Granted Aug 13, 2019·12 cites·5 claims
- 0388US11024535B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2019·Granted Jun 1, 2021·4 cites·19 claims
- 0473US10056328B2Ruthenium metal feature fill for interconnectsTOKYO ELECTRON LTD·Filed 2017·Granted Aug 21, 2018·1 cites·19 claims
- 0570US9711449B2Ruthenium metal feature fill for interconnectsTOKYO ELECTRON LTD·Filed 2016·Granted Jul 18, 2017·1 cites·20 claims
- 0669US12284820B2Dual metal wrap-around contacts for semiconductor devicesTOKYO ELECTRON LTD·Filed 2022·Granted Apr 22, 2025·0 cites·16 claims
- 0764US11621190B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 0861US11374101B2Dual metal wrap-around contacts for semiconductor devicesTOKYO ELECTRON LTD·Filed 2020·Granted Jun 28, 2022·0 cites·10 claims
- 0948US2017241014A1Ruthenium metal deposition method for electrical connectionsTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →