Inventor · disambiguated record
Lieh-Chuan Chen
Also filed as: CHEN LIEH-CHUAN
18 granted patents·3 pending applications·20 citations·filing 2013–2025
90Inventor score
Top patents by PatentIndex Score
21 records- 0195US11374107B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·19 claims
- 0294US9941384B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 10, 2018·8 cites·20 claims
- 0384US12183709B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0482US11088108B2Chip package structure including ring-like structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0579US12027603B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 0679US11848302B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0776US2025357449A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875US11901433B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 0975US9166046B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 20, 2015·3 cites·20 claims
- 1073US11545463B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 1170US9666511B2Isolation method for a stand alone high voltage laterally-diffused metal-oxide semiconductor (LDMOS) transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·18 claims
- 1269US9608060B2Isolation structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·18 claims
- 1363US10686054B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 1462US10134867B2Method for fabricating semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 20, 2018·0 cites·20 claims
- 1562US2023420429A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1655US2024297087A1Package module with a module stiffener and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1751US9748377B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
- 1844US9564515B2Semiconductor device having super junction structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·19 claims
- 1942US9698256B2Termination of super junction power MOSFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·0 cites·19 claims
- 2041US9985094B2Super junction with an angled trench, transistor having the super junction and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 29, 2018·0 cites·20 claims
- 2141US9184282B2Ultra-high voltage laterally-diffused MOS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →