Inventor · disambiguated record
Hyungsun Jang
Also filed as: JANG HYUNGSUN
8 granted patents·5 pending applications·6 citations·filing 2013–2024
77Inventor score
Top patents by PatentIndex Score
13 records- 0191US11967578B2Semiconductor package including postSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 0291US11769743B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0377US2025105187A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0475US12237285B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0574US12322720B2Semiconductor package including postSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0659US9958260B2Apparatus and method for extracting feature point for recognizing obstacle using laser scannerHYUNDAI MOTOR CO LTD·Filed 2013·Granted May 1, 2018·2 cites·14 claims
- 0759US2024395747A1Semiconductor package and method of inspecting the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US2024142493A1Socket for testing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0956US2024387421A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1055US2024128175A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1147US11557560B2Semiconductor package for improving reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1240US9827994B2System and method for writing occupancy grid map of sensor centered coordinate system using laser scannerHYUNDAI MOTOR CO LTD·Filed 2015·Granted Nov 28, 2017·0 cites·6 claims
- 1339US9810787B2Apparatus and method for recognizing obstacle using laser scannerHYUNDAI MOTOR CO LTD·Filed 2013·Granted Nov 7, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →