Inventor · disambiguated record
Yuan-Liang Li
Also filed as: LI YUAN · LI YUAN-LIANG
97 granted patents·12 pending applications·2,210 citations·filing 1999–2023
99Inventor score
Top patents by PatentIndex Score
109 records- 0199US6388207B1Electronic assembly with trench structures and methods of manufactureINTEL CORP·Filed 2000·Granted May 14, 2002·238 cites·52 claims
- 0298US6580611B1Dual-sided heat removal systemINTEL CORP·Filed 2002·Granted Jun 17, 2003·176 cites·31 claims
- 0398US6446317B1Hybrid capacitor and method of fabrication thereforINTEL CORP·Filed 2000·Granted Sep 10, 2002·208 cites·16 claims
- 0497US7518248B2Inductive filters and methods of fabrication thereforINTEL CORP·Filed 2006·Granted Apr 14, 2009·46 cites·15 claims
- 0597US6346743B1Embedded capacitor assembly in a packageINTEL CORP·Filed 2000·Granted Feb 12, 2002·127 cites·43 claims
- 0696US7459782B1Stiffener for flip chip BGA packageALTERA CORP·Filed 2005·Granted Dec 2, 2008·80 cites·16 claims
- 0794US9196575B1Integrated circuit package with cavity in substrateALTERA CORP·Filed 2013·Granted Nov 24, 2015·27 cites·17 claims
- 0894US7585702B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2005·Granted Sep 8, 2009·38 cites·12 claims
- 0994US7144756B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2005·Granted Dec 5, 2006·32 cites·13 claims
- 1094US6661943B2Fiber-free optical interconnect system for chip-to-chip signalingINTEL CORP·Filed 2002·Granted Dec 9, 2003·65 cites·19 claims
- 1194US6366467B1Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2000·Granted Apr 2, 2002·97 cites·12 claims
- 1293US6493861B1Interconnected series of plated through hole vias and method of fabrication thereforINTEL CORP·Filed 1999·Granted Dec 10, 2002·73 cites·35 claims
- 1392US6907658B2Manufacturing methods for an electronic assembly with vertically connected capacitorsINTEL CORP·Filed 2003·Granted Jun 21, 2005·58 cites·30 claims
- 1492US6599031B2Optical/electrical interconnects and package for high speed signalingINTEL CORP·Filed 2001·Granted Jul 29, 2003·51 cites·22 claims
- 1591US6713860B2Electronic assembly and system with vertically connected capacitorsINTEL CORP·Filed 2001·Granted Mar 30, 2004·46 cites·35 claims
- 1689US6949404B1Flip chip package with warpage controlALTERA CORP·Filed 2002·Granted Sep 27, 2005·65 cites·23 claims
- 1788US7317622B2Method and apparatus for supplying power to a semiconductor device using a capacitor DC shuntINTEL CORP·Filed 2002·Granted Jan 8, 2008·36 cites·5 claims
- 1888US7133294B2Integrated circuit packages with sandwiched capacitorsINTEL CORP·Filed 2005·Granted Nov 7, 2006·16 cites·24 claims
- 1987US6909176B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2003·Granted Jun 21, 2005·41 cites·14 claims
- 2087US6469908B2Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2002·Granted Oct 22, 2002·40 cites·7 claims
- 2186US6920051B2Hybrid capacitor, circuit, and systemINTEL CORP·Filed 2002·Granted Jul 19, 2005·37 cites·11 claims
- 2286US6559484B1Embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted May 6, 2003·44 cites·30 claims
- 2384US7009307B1Low stress and warpage laminate flip chip BGA packageALTERA CORP·Filed 2004·Granted Mar 7, 2006·35 cites·33 claims
- 2482US8212353B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateWANG WEN-CHOU VINCENT·Filed 2010·Granted Jul 3, 2012·8 cites·14 claims
- 2582US7741160B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2009·Granted Jun 22, 2010·9 cites·6 claims
- 2682US6888238B1Low warpage flip chip package solution-channel heat spreaderALTERA CORP·Filed 2003·Granted May 3, 2005·30 cites·21 claims
- 2781US10084486B1High speed turbo decoderINTEL CORP·Filed 2017·Granted Sep 25, 2018·5 cites·25 claims
- 2881US6841842B2Method and apparatus for electrical-optical packaging with capacitive DC shuntsINTEL CORP·Filed 2003·Granted Jan 11, 2005·25 cites·32 claims
- 2981US6624444B1Electrical-optical package with capacitor DC shunts and associated methodsINTEL CORP·Filed 2002·Granted Sep 23, 2003·26 cites·26 claims
- 3080US6558169B2Shunt power connection for an integrated circuit packageINTEL CORP·Filed 2001·Granted May 6, 2003·24 cites·26 claims
- 3179US9330997B1Heat spreading structures for integrated circuitsALTERA CORP·Filed 2014·Granted May 3, 2016·6 cites·17 claims
- 3279US7580269B2Apparatus for supplying power to a semiconductor device using a capacitor DC shuntINTEL CORP·Filed 2007·Granted Aug 25, 2009·6 cites·7 claims
- 3379US6519134B1Universal capacitor terminal designINTEL CORP·Filed 2000·Granted Feb 11, 2003·28 cites·10 claims
- 3478US8930791B2Early stop method and apparatus for turbo decodingLI YUAN·Filed 2012·Granted Jan 6, 2015·5 cites·2 claims
- 3578US7883937B1Electronic package and method of forming the sameALTERA CORP·Filed 2007·Granted Feb 8, 2011·7 cites·11 claims
- 3677US12293956B2Boiling enhancement structures for immersion cooled electronic systemsINTEL CORP·Filed 2021·Granted May 6, 2025·1 cites·24 claims
- 3777US7321167B2Flex tape architecture for integrated circuit signal ingress/egressINTEL CORP·Filed 2003·Granted Jan 22, 2008·27 cites·5 claims
- 3877US6803649B1Electronic assemblyINTEL CORP·Filed 2003·Granted Oct 12, 2004·21 cites·20 claims
- 3976US6636416B2Electronic assembly with laterally connected capacitors and manufacturing methodINTEL CORP·Filed 2001·Granted Oct 21, 2003·19 cites·29 claims
- 4075US9312427B2Semiconductor structure and method for forming the sameLI YUAN·Filed 2012·Granted Apr 12, 2016·2 cites·8 claims
- 4175US7417872B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2006·Granted Aug 26, 2008·5 cites·5 claims
- 4275US6900991B2Electronic assembly with sandwiched capacitors and methods of manufactureINTEL CORP·Filed 2001·Granted May 31, 2005·20 cites·42 claims
- 4375US6509640B1Integral capacitor using embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted Jan 21, 2003·32 cites·30 claims
- 4474US6948943B2Shunting arrangements to reduce high currents in grid array connectorsINTEL CORP·Filed 2002·Granted Sep 27, 2005·21 cites·58 claims
- 4573US9131603B2Signal line pairs on a circuit board which are displaced from each other relative to a center lineINTEL CORP·Filed 2013·Granted Sep 8, 2015·2 cites·25 claims
- 4673US6495770B2Electronic assembly providing shunting of electrical currentINTEL CORP·Filed 2000·Granted Dec 17, 2002·21 cites·20 claims
- 4772US7111271B2Inductive filters and methods of fabrication thereofINTEL CORP·Filed 2002·Granted Sep 19, 2006·12 cites·8 claims
- 4872US6717066B2Electronic packages having multiple-zone interconnects and methods of manufactureINTEL CORP·Filed 2001·Granted Apr 6, 2004·14 cites·54 claims
- 4971US7834142B2Shortened glucagon-like peptide 1(sGLP-1) preparation method and applicationDALIAN D N BIO ENGINEERING CO·Filed 2006·Granted Nov 16, 2010·2 cites·7 claims
- 5069US8198699B1Integrated circuit package with non-solder mask defined like padsXIE YUANLIN·Filed 2010·Granted Jun 12, 2012·4 cites·17 claims
Showing the top 50 of 109 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →