Inventor · disambiguated record
Jennie S. Hwang
Also filed as: HWANG JENNIE S
10 granted patents·3 pending applications·436 citations·filing 1983–2018
92Inventor score
Files withSCM CORP4TECHNOLOGIES GROUP INC H3ANTAYA TECH CORP2ANTAYA TECH CORPORATION1HWANG JENNIE S1
Top patents by PatentIndex Score
13 records- 0193US5520752AComposite soldersUS ARMY·Filed 1994·Granted May 28, 1996·121 cites·9 claims
- 0289US4619715AFusible powdered metal pasteSCM CORP·Filed 1985·Granted Oct 28, 1986·53 cites·38 claims
- 0388US4541876ANonaqueous powdered metal paste compositionSCM CORP·Filed 1984·Granted Sep 17, 1985·41 cites·18 claims
- 0487US6176947B1Lead-free soldersTECHNOLOGIES GROUP INC H·Filed 1999·Granted Jan 23, 2001·100 cites·10 claims
- 0587US4460414ASolder paste and vehicle thereforSCM CORP·Filed 1983·Granted Jul 17, 1984·37 cites·10 claims
- 0685US5985212AHigh strength lead-free solder materialsTECHNOLOGIES GROUP INC H·Filed 1996·Granted Nov 16, 1999·59 cites·1 claims
- 0784US10105794B2Method of forming a lead-free solder compositionANTAYA TECH CORPORATION·Filed 2018·Granted Oct 23, 2018·3 cites·12 claims
- 0878US9975207B2Lead-free solder compositionANTAYA TECH CORP·Filed 2014·Granted May 22, 2018·3 cites·39 claims
- 0974US8771592B2Lead-free solder compositionHWANG JENNIE S·Filed 2012·Granted Jul 8, 2014·3 cites·18 claims
- 1066US4557767AFusible powdered metal pasteSCM CORP·Filed 1984·Granted Dec 10, 1985·16 cites·57 claims
- 1154US2017190004A1Lead-free solder compositionANTAYA TECH CORP·Filed 2017·Application pending·0 cites
- 1239US2002155024A1Lead-free solder compositionsTECHNOLOGIES GROUP INC H·Filed 2001·Application pending·0 cites
- 1339US2004241039A1High temperature lead-free solder compositionsTECHNOLOGIES GROUP H·Filed 2004·Application pending·0 cites
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