Inventor · disambiguated record
Hinmeng Au
Also filed as: AU HINMENG
9 granted patents·1 pending application·197 citations·filing 2009–2024
88Inventor score
Top patents by PatentIndex Score
10 records- 0198US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0295US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 0391US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 0491US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 0589US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0686US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0782US11824008B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·24 claims
- 0880US8532449B2Wafer integrated optical sub-modulesMOHAMMED EDRIS M·Filed 2010·Granted Sep 10, 2013·7 cites·5 claims
- 0975US11876053B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 1063US8383949B2Method to form lateral pad on edge of waferINTEL CORP·Filed 2009·Granted Feb 26, 2013·3 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →