Inventor · disambiguated record
Tsung-Yueh Tsai
Also filed as: TSAI TSUNG-YUEH
40 granted patents·12 pending applications·252 citations·filing 2002–2025
97Inventor score
Files withADVANCED SEMICONDUCTOR ENG31LAI YI-SHAO6ASIA OPTICAL CO INC5CHANG HSIAO-CHUAN5CHANG CHIEN PAO-HUEI1
Top patents by PatentIndex Score
52 records- 0193US11682653B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·2 cites·13 claims
- 0293US10522505B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·7 cites·20 claims
- 0392US10937761B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 2, 2021·5 cites·15 claims
- 0492US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0592US7026709B2Stacked chip-packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 11, 2006·98 cites·14 claims
- 0690US11133423B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·6 cites·18 claims
- 0790US8115285B2Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereofCHEN CHIEN-WEN·Filed 2008·Granted Feb 14, 2012·22 cites·27 claims
- 0889US8274149B2Semiconductor device package having a buffer structure and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Sep 25, 2012·14 cites·14 claims
- 0983US8072064B1Semiconductor package and method for making the sameLAI YI-SHAO·Filed 2010·Granted Dec 6, 2011·9 cites·21 claims
- 1083US2025239569A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1182US12272671B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 8, 2025·0 cites·10 claims
- 1281US10242940B2Fan-out ball grid array package structure and process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 26, 2019·4 cites·21 claims
- 1378US2024332274A1Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1477US7980757B2Bonding strength measuring deviceADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jul 19, 2011·5 cites·6 claims
- 1575US12009353B2Optical device package with compatible lid and carrierADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jun 11, 2024·0 cites·7 claims
- 1674US10147835B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 4, 2018·2 cites·21 claims
- 1772US9618191B2Light emitting package and LED bulbADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Apr 11, 2017·2 cites·33 claims
- 1866US7964949B2Tenon-and-mortise packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 21, 2011·4 cites·12 claims
- 1964US11776889B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 3, 2023·0 cites·18 claims
- 2064US11764311B2Optical device and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 2163US11302682B2Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 2262US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 2361US7969559B2Laser distance measuring apparatus and control method thereofASIA OPTICAL CO INC·Filed 2009·Granted Jun 28, 2011·3 cites·18 claims
- 2460US8368216B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·1 cites·20 claims
- 2560US6854900B2Method of fabricating a wavelength division multiplexed (WDM) unitASIA OPTICAL CO INC·Filed 2002·Granted Feb 15, 2005·7 cites·12 claims
- 2659US6873778B2Fiber container and associated optical communication deviceASIA OPTICAL CO INC·Filed 2002·Granted Mar 29, 2005·5 cites·23 claims
- 2758US7955897B2Chip structure and stacked chip package as well as method for manufacturing chip structuresADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jun 7, 2011·1 cites·5 claims
- 2856US6801429B2Package structure compatible with cooling systemADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Oct 5, 2004·7 cites·6 claims
- 2955US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 3053US10545581B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 28, 2020·0 cites·24 claims
- 3152US11024570B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 1, 2021·0 cites·25 claims
- 3252US8253431B2Apparatus and method for testing non-contact pads of a semiconductor device to be testedLAI YI-SHAO·Filed 2010·Granted Aug 28, 2012·1 cites·10 claims
- 3352US7037750B2Method for manufacturing a packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 2, 2006·6 cites·11 claims
- 3451US7773203B2Laser distance-measuring apparatus and control methods thereofASIA OPTICAL CO INC·Filed 2009·Granted Aug 10, 2010·1 cites·17 claims
- 3550US8076786B2Semiconductor package and method for packaging a semiconductor packageHUNG CHANG YING·Filed 2009·Granted Dec 13, 2011·1 cites·20 claims
- 3648US8018075B2Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 3747US7015065B2Manufacturing method of ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 21, 2006·2 cites·15 claims
- 3846US7071553B2Package structure compatible with cooling systemADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 4, 2006·2 cites·7 claims
- 3946US2009051031A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 4046US2009051048A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 4144US2007222047A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4244US2010200974A1Semiconductor package structure using the sameWENG CHAO-FU·Filed 2009·Application pending·0 cites
- 4343US2007284756A1Stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4440US6797941B2Reliable optical add/drop deviceASIA OPTICAL CO INC·Filed 2002·Granted Sep 28, 2004·0 cites·19 claims
- 4540US2011156739A1Test kit for testing a chip subassembly and a testing method by using the sameCHANG HSIAO-CHUAN·Filed 2009·Application pending·0 cites
- 4639US8592982B2Semiconductor package having proximity communication signal input terminals and manufacturing methods thereofLAI YI-SHAO·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 4738US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
- 4835US2012091575A1Semiconductor Package And Method For Making The SameLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 4935US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
- 5035US2011298139A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →