Inventor · disambiguated record
Jong-Suk Bae
Also filed as: BAE JONG S · BAE JONG SUK
2 granted patents·1 pending application·7 citations·filing 2004–2007
50Inventor score
Top patents by PatentIndex Score
3 records- 0152US8549744B2Printed circuit board using bump and method for manufacturing thereofSHIN HEE-BUM·Filed 2007·Granted Oct 8, 2013·1 cites·9 claims
- 0251US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 0338US2006060558A1Method of fabricating package substrate using electroless nickel platingSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →