Inventor · disambiguated record
Duck Young Maeng
Also filed as: MAENG DUCK Y · MAENG DUCK-YOUNG
3 granted patents·8 pending applications·6 citations·filing 2004–2023
56Inventor score
Top patents by PatentIndex Score
11 records- 0174US2023354513A1Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0269US11744012B2Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 0360US11758653B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 12, 2023·0 cites·29 claims
- 0451US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 0546US2014027167A1Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0644US2009194318A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0741US2012312775A1Method for manufacturing a printed circuit boardYEON JE-SIK·Filed 2012·Application pending·0 cites
- 0839US2014185254A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0938US2006060558A1Method of fabricating package substrate using electroless nickel platingSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1037US2006029726A1Method of fabricating PCB in parallel mannerMOK JEE-SOO·Filed 2004·Application pending·0 cites
- 1132US2007132476A1Method of forming circuit pattern on printed circuit boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →