Inventor · disambiguated record
Chee Kiang Yew
Also filed as: YEW CHEE KIANG
15 granted patents·2 pending applications·859 citations·filing 1997–2004
95Inventor score
Top patents by PatentIndex Score
17 records- 0192US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 0290US5956233AHigh density single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 21, 1999·132 cites·20 claims
- 0389US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 0487US6091140AThin chip-size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 18, 2000·114 cites·13 claims
- 0587US6049129AChip size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 11, 2000·108 cites·36 claims
- 0685US6468831B2Method of fabricating thin integrated circuit unitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 22, 2002·43 cites·9 claims
- 0785US6218202B1Semiconductor device testing and burn-in methodologyTEXAS INSTRUMENTS INC·Filed 1998·Granted Apr 17, 2001·101 cites·7 claims
- 0879US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 0978US7089661B2Method for packaging small size memory cardsFLEX P IND SDN BHD·Filed 2003·Granted Aug 15, 2006·29 cites·28 claims
- 1076US6278616B1Modifying memory device organization in high density packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 21, 2001·55 cites·22 claims
- 1169US6274929B1Stacked double sided integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 14, 2001·35 cites·12 claims
- 1268US6084306ABridging method of interconnects for integrated circuit packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 4, 2000·37 cites·17 claims
- 1362US6602803B2Direct attachment semiconductor chip to organic substrateTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 5, 2003·27 cites·19 claims
- 1458US7042070B2Direct attachment of semiconductor chip to organic substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted May 9, 2006·8 cites·14 claims
- 1535US2005033996A1Method and apparatus for a communication hubFiled 2003·Application pending·0 cites
- 1634US6768646B1High density internal ball grid array integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 27, 2004·7 cites·20 claims
- 1733US2004245674A1Method for packaging small size memory cardsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →