Inventor · disambiguated record
Oscar Ou
Also filed as: OU OSCAR
4 granted patents·1 pending application·84 citations·filing 2001–2004
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0182US7394150B2Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 1, 2008·35 cites·17 claims
- 0282US7238551B2Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 3, 2007·37 cites·18 claims
- 0359US6744119B2Leadframe having slots in a die padSILICONIX TAIWAN LTD·Filed 2001·Granted Jun 1, 2004·11 cites·20 claims
- 0440US6414362B1Power semiconductor deviceSILICONX TAIWAN LTD·Filed 2001·Granted Jul 2, 2002·1 cites·1 claims
- 0533US2001052641A1Power semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →