Inventor · disambiguated record
Keun Yong Lee
Also filed as: LEE KEUN YONG
12 granted patents·29 pending applications·25 citations·filing 1999–2019
85Inventor score
Top patents by PatentIndex Score
41 records- 0184US8101248B2Composition for forming substrate, and prepreg and substrate using the sameYUN GEUM HEE·Filed 2010·Granted Jan 24, 2012·7 cites·19 claims
- 0279US8105663B2Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2009·Granted Jan 31, 2012·6 cites·21 claims
- 0377US8822832B2Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 2, 2014·2 cites·21 claims
- 0472US9035738B2Multilayer inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 19, 2015·2 cites·21 claims
- 0564US8790843B2Fuel cell stackNA YOUNG-SEUNG·Filed 2008·Granted Jul 29, 2014·1 cites·17 claims
- 0658US9237654B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·6 claims
- 0757US9288902B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 15, 2016·0 cites·5 claims
- 0853US9236177B2Common mode filterSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 12, 2016·0 cites·5 claims
- 0952US2015097647A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1052US2014080941A1Insulating composition for multilayer printed circuit board, method for preparing the same, and multilayer printed circuit board comprising the same as insulating layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1151US8232021B2Stack for fuel cellSUH JUN-WON·Filed 2008·Granted Jul 31, 2012·0 cites·12 claims
- 1251US2015114696A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1351US2015114691A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1451US2008318114A1Separator for fuel cell and its manufacturing method and fuel cell stack using the separatorLEE JAE-WOOK·Filed 2008·Application pending·0 cites
- 1550US9107307B2Resin composition for printed circuit board, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·14 claims
- 1650US2014106147A1Prepreg, copper clad laminate, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1750US2014154479A1Resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1850US2020090848A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 1950US2019298852A1Self-healing hydrogel and use thereofUNIV HANYANG IND UNIV COOP FOUND·Filed 2019·Application pending·0 cites
- 2049US8829155B2Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the sameCHO JAE-CHOON·Filed 2009·Granted Sep 9, 2014·0 cites·6 claims
- 2149US2015002253A1Thin-layer type common mode filter and method for preparing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2248US2014066545A1Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2348US2013146344A1Insulating resin composition for printed circuit board and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2448US2015053457A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECHANICS LTD·Filed 2014·Application pending·0 cites
- 2547US2009092873A1Fuel cell stackJEONG SUNG-WON·Filed 2008·Application pending·0 cites
- 2647US2015050504A1Core substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2747US2014063427A1Resin composition for thermal radiation board and thermal radiation board comprising the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2846US2014080940A1Resin composition for insulation, insulating film, prepreg, and printed circuit board.SAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2946US2015104630A1Prepreg for printed circuit board, manufacturing method thereof, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3046US2015060115A1Copper clad laminate for printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3145US2009072207A1Flame retardant resin composition for printed circuit board, printed circuit board using the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3245US2017086292A1Prepreg and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3345US2014002226A1Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3445US2014076198A1Epoxy resin composition for insulation, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3545US2014034367A1Epoxy resin composition for pritned circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3642US2015027763A1Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3741US2014079924A1Resin composition for package substrate and package substrate comprising core layer and prepreg using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3838US2013098666A1Resin composition for printed circuit board and printed circuit board including the sameLEE KEUN YONG·Filed 2011·Application pending·0 cites
- 3937US2017086290A1Prepreg, printed circuit board including prepreg, and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4035US2011172357A1Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2010·Application pending·0 cites
- 4133US6386102B1Alignment layer printing deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 14, 2002·7 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →