Inventor · disambiguated record
Keita Miyazato
Also filed as: MIYAZATO KEITA
4 granted patents·41 citations·filing 1988–1992
76Inventor score
Top patents by PatentIndex Score
4 records- 0153US5328752ASubstrate for printed circuit boards using photocurable resin and process for producing the sameNITTO BOSEKI CO LTD·Filed 1992·Granted Jul 12, 1994·20 cites·8 claims
- 0245US4900614AGlass fiber base material for print wiring substrateNITTO BOSEKI CO LTD·Filed 1988·Granted Feb 13, 1990·11 cites·6 claims
- 0340US4943452AMethod for improving composite materials by use of a silane coupling agentSHINETSU CHEMICAL CO·Filed 1988·Granted Jul 24, 1990·7 cites·11 claims
- 0432US5022922AAgent for improving composite materialsSHINETSU CHEMICAL CO·Filed 1990·Granted Jun 11, 1991·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →