Inventor · disambiguated record
Zlata Kovac
Also filed as: KOVAC ZLATA
25 granted patents·1 pending application·2,313 citations·filing 1974–2005
98Inventor score
Top patents by PatentIndex Score
26 records- 0199US5659952AMethod of fabricating compliant interface for semiconductor chipTESSERA INC·Filed 1994·Granted Aug 26, 1997·491 cites·48 claims
- 0299US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 0395US6525429B1Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2000·Granted Feb 25, 2003·69 cites·20 claims
- 0495US6012224AMethod of forming compliant microelectronic mounting deviceTESSERA INC·Filed 1997·Granted Jan 11, 2000·157 cites·19 claims
- 0595US5491302AMicroelectronic bonding with lead motionTESSERA INC·Filed 1994·Granted Feb 13, 1996·159 cites·36 claims
- 0694US6274820B1Electrical connections with deformable contactsTESSERA INC·Filed 2000·Granted Aug 14, 2001·52 cites·41 claims
- 0794US5706174ACompliant microelectrionic mounting deviceTESSERA INC·Filed 1997·Granted Jan 6, 1998·142 cites·13 claims
- 0894US5548091ASemiconductor chip connection components with adhesives and methods for bonding to the chipTESSERA INC·Filed 1993·Granted Aug 20, 1996·151 cites·16 claims
- 0993US6030856ABondable compliant pads for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 1997·Granted Feb 29, 2000·127 cites·36 claims
- 1092US6870272B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2002·Granted Mar 22, 2005·55 cites·21 claims
- 1192US6266874B1Methods of making microelectronic components having electrophoretically deposited layersTESSERA INC·Filed 1998·Granted Jul 31, 2001·62 cites·16 claims
- 1291US7368818B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2005·Granted May 6, 2008·18 cites·15 claims
- 1391US4239789AMaskless method for electroless plating patternsIBM·Filed 1979·Granted Dec 16, 1980·43 cites·7 claims
- 1490US6255738B1Encapsulant for microelectronic devicesTESSERA INC·Filed 1997·Granted Jul 3, 2001·127 cites·70 claims
- 1589US6723584B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2002·Granted Apr 20, 2004·39 cites·20 claims
- 1687US6239386B1Electrical connections with deformable contactsTESSERA INC·Filed 1996·Granted May 29, 2001·48 cites·36 claims
- 1787US6133639ACompliant interface for semiconductor chip and method thereforTESSERA INC·Filed 1997·Granted Oct 17, 2000·66 cites·18 claims
- 1886US6045655AMethod of mounting a connection component on a semiconductor chip with adhesivesTESSERA INC·Filed 1998·Granted Apr 4, 2000·66 cites·35 claims
- 1985US5875545AMethod of mounting a connection component on a semiconductor chip with adhesivesTESSERA INC·Filed 1996·Granted Mar 2, 1999·63 cites·12 claims
- 2082US6373141B1Bondable compliant pads for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 1999·Granted Apr 16, 2002·54 cites·15 claims
- 2180US6202299B1Semiconductor chip connection components with adhesives and methods of making sameTESSERA INC·Filed 1998·Granted Mar 20, 2001·46 cites·4 claims
- 2277US6370032B1Compliant microelectronic mounting deviceTESSERA INC·Filed 1999·Granted Apr 9, 2002·38 cites·20 claims
- 2372US5619017AMicroelectronic bonding with lead motionTESSERA INC·Filed 1995·Granted Apr 8, 1997·37 cites·4 claims
- 2472US3990981AWater based magnetic inks and the manufacture thereofIBM·Filed 1974·Granted Nov 9, 1976·20 cites·31 claims
- 2562US4107063AWater based selectable charge magnetic inksIBM·Filed 1977·Granted Aug 15, 1978·11 cites·37 claims
- 2647US2005139986A1Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →