Inventor · disambiguated record
Shinya Tateda
Also filed as: TATEDA SHINYA
12 granted patents·2 pending applications·330 citations·filing 2000–2021
91Inventor score
Top patents by PatentIndex Score
14 records- 0194US6730731B2Thermally conductive polymer composition and thermally conductive molded articlePOLYMATECH CO LTD·Filed 2001·Granted May 4, 2004·96 cites·14 claims
- 0294US6649012B2Adhesion method and electronic componentPOLYMATECH CO LTD·Filed 2000·Granted Nov 18, 2003·98 cites·5 claims
- 0393US7264869B2Thermally conductive molded article and method of making the samePOLYMATECH CO LTD·Filed 2002·Granted Sep 4, 2007·65 cites·10 claims
- 0489US6794035B2Graphitized carbon fiber powder and thermally conductive compositionPOLYMATECH CO LTD·Filed 2002·Granted Sep 21, 2004·29 cites·19 claims
- 0569US7291381B2Thermally conductive formed article and method of manufacturing the samePOLYMATECH CO LTD·Filed 2003·Granted Nov 6, 2007·10 cites·16 claims
- 0664US7598466B2Key sheetPOLYMATECH CO LTD·Filed 2007·Granted Oct 6, 2009·4 cites·19 claims
- 0763US6761842B2Heat conductive mold and manufacturing method thereofPOLYMATECH CO LTD·Filed 2003·Granted Jul 13, 2004·10 cites·17 claims
- 0863US6663969B2Heat conductive adhesive film and manufacturing method thereof and electronic componentPOLYMATECH CO LTD·Filed 2001·Granted Dec 16, 2003·15 cites·9 claims
- 0951US11987124B2Capacitive input deviceSEKISUI POLYMATECH CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1051US9910536B2Touch sensor and touch panel devicePOLYMATECH JAPAN CO LTD·Filed 2014·Granted Mar 6, 2018·0 cites·6 claims
- 1150US6918983B2Adhesion method and electronic componentPOLYMATECH CO LTD·Filed 2003·Granted Jul 19, 2005·3 cites·8 claims
- 1241US2003064017A1Carbon fiber powder, a method of making the same, and thermally conductive compositionFiled 2002·Application pending·0 cites
- 1338US10738965B2Input component, sensor sheet, and decorative componentPOLYMATECH JAPAN CO LTD·Filed 2015·Granted Aug 11, 2020·0 cites·14 claims
- 1435US2001004546A1Heat conductive mold and manufacturing method thereofFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →