Inventor · disambiguated record
Kazuhiko Asakawa
Also filed as: ASAKAWA KAZUHIKO
8 granted patents·2 pending applications·43 citations·filing 1978–2010
83Inventor score
Top patents by PatentIndex Score
10 records- 0172US6782512B2Fabrication method for a semiconductor device with dummy patternsOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 24, 2004·18 cites·15 claims
- 0254US7737547B2Dummy buried contacts and vias for improving contact via resistance in a semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jun 15, 2010·1 cites·16 claims
- 0353US7018926B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 28, 2006·5 cites·10 claims
- 0451US6933238B2Method for manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Aug 23, 2005·6 cites·19 claims
- 0548US4338510AElectrode type steam vaporizer having corrosion resistant nickel ferrite electrodes and a protective coverTDK ELECTRONICS CO LTD·Filed 1978·Granted Jul 6, 1982·12 cites·10 claims
- 0647US2006270249A1Semiconductor device and method of fabricating the sameASAKAWA KAZUHIKO·Filed 2006·Application pending·0 cites
- 0744US7105464B2Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Sep 12, 2006·1 cites·12 claims
- 0838US6787886B1Semiconductor device and methods of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Sep 7, 2004·0 cites·13 claims
- 0936US7039488B2Method of determining remaining film thickness in polishing processOKI ELECTRIC IND CO LTD·Filed 2004·Granted May 2, 2006·0 cites·10 claims
- 1035US2011089569A1Multilayer wiring, method for placing dummy wiring in multilayer wiring, semiconductor device, and semiconductor device manufacturing methodOKI SEMICONDUCTOR CO LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →