Inventor · disambiguated record
Yasuhiro Megawa
Also filed as: MEGAWA YASUHIRO
8 granted patents·6 pending applications·22 citations·filing 2006–2024
82Inventor score
Technology areasH10P
Top patents by PatentIndex Score
14 records- 0185US10840094B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 17, 2020·4 cites·19 claims
- 0285US7682987B2Device for processing substrate and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2007·Granted Mar 23, 2010·8 cites·11 claims
- 0378US7713883B2Manufacturing method of a semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted May 11, 2010·5 cites·15 claims
- 0473US8448599B2Device for processing a substrate, method of processing a substrate and method of manufacturing semiconductor deviceYUASA KAZUHIRO·Filed 2011·Granted May 28, 2013·2 cites·16 claims
- 0567US8901013B2Substrate processing apparatus, method of processing substrate and method of manufacturing semiconductor deviceYUASA KAZUHIRO·Filed 2011·Granted Dec 2, 2014·2 cites·15 claims
- 0665US12435439B2Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0765US8003411B2Device for processing a substrate, method of processing a substrate and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Aug 23, 2011·1 cites·9 claims
- 0861US2025105007A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0956US2024105465A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1054US12503762B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 23, 2025·0 cites·23 claims
- 1151US2023295837A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1245US2010192855A1Manufacturing method of a semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 1342US2009064765A1Method of Manufacturing Semiconductor DeviceHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 1435US2011065286A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →