Inventor · disambiguated record
Teppei Higashitsuji
Also filed as: HIGASHITSUJI TEPPEI
12 granted patents·4 pending applications·24 citations·filing 2007–2025
87Inventor score
Top patents by PatentIndex Score
16 records- 0198US11315950B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Apr 26, 2022·4 cites·12 claims
- 0292US10818691B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 27, 2020·4 cites·13 claims
- 0390US12183401B2Semiconductor storage deviceKIOXIA CORP·Filed 2023·Granted Dec 31, 2024·1 cites·16 claims
- 0489US12274065B2Semiconductor memory deviceKIOXIA CORP·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0589US9437300B2Semiconductor memory deviceTOSHIBA KK·Filed 2014·Granted Sep 6, 2016·12 cites·20 claims
- 0683US12022657B2Semiconductor memory deviceKIOXIA CORP·Filed 2023·Granted Jun 25, 2024·0 cites·11 claims
- 0783US2025212406A1Semiconductor memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0879US11621278B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Apr 4, 2023·0 cites·9 claims
- 0977US2025087274A1Semiconductor storage deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1073US9893078B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 13, 2018·1 cites·19 claims
- 1167US11810620B2Semiconductor storage deviceKIOXIA CORP·Filed 2021·Granted Nov 7, 2023·0 cites·13 claims
- 1265US10461093B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 1360US7709906B2Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2007·Granted May 4, 2010·2 cites·9 claims
- 1458US12362021B2Semiconductor memoryKIOXIA CORP·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 1545US2024305279A1Data latch circuit, semiconductor device, and semiconductor storage deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1637US2015062843A1Semiconductor device and electronic apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →