Inventor · disambiguated record
Christian Kasztelan
Also filed as: KASZTELAN CHRISTIAN
9 granted patents·7 pending applications·25 citations·filing 2015–2024
84Inventor score
Top patents by PatentIndex Score
16 records- 0193US9837288B2Semiconductor power package and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Dec 5, 2017·8 cites·20 claims
- 0292US11641779B2Thermoelectric devices and methods for forming thermoelectric devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 2, 2023·2 cites·8 claims
- 0389US11769701B2Protector cap for package with thermal interface materialINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 26, 2023·2 cites·9 claims
- 0488US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 0587US10256119B2Method of manufacturing a semiconductor power packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 0674US12211761B2Protector cap for package with thermal interface materialINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jan 28, 2025·0 cites·8 claims
- 0774US10734250B2Method of manufacturing a package having a power semiconductor chipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 4, 2020·1 cites·21 claims
- 0872US2025125218A1Electronic module having a clip connected to a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0960US11276680B2Power semiconductor device with integrated temperature protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Mar 15, 2022·1 cites·18 claims
- 1060US2024297111A1Carrier structure, package arrangement, method of forming a carrier structure, and method of forming a package arrangementINFINEON TECHOLOGIES AG·Filed 2024·Application pending·0 cites
- 1159US12218030B2Electronic module comprising a semiconductor package with integrated clip and fastening elementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Feb 4, 2025·0 cites·2 claims
- 1259US2021020541A1Thermal interface material having defined thermal, mechanical and electric propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Application pending·0 cites
- 1352US2019131508A1Thermoelectric Devices and Methods for Forming Thermoelectric DevicesINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1447US2017117208A1Thermal interface material having defined thermal, mechanical and electric propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Application pending·0 cites
- 1535US2016372393A1Laminar Structure, a Semiconductor Device and Methods for Forming Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1634US2016365296A1Electronic Devices with Increased Creepage DistancesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →