Inventor · disambiguated record
Kevin Becker
Also filed as: BECKER KEVIN · BECKER KEVIN H · BECKER KEVIN HARRIS
3 granted patents·5 pending applications·24 citations·filing 1998–2017
59Inventor score
Top patents by PatentIndex Score
8 records- 0168US6066710AImide-containing polymers made by bulk polymerizationOCCIDENTAL CHEM CO·Filed 1998·Granted May 23, 2000·24 cites·20 claims
- 0257US8759422B2B-stageable and skip-curable wafer back side coating adhesivesHENKEL CORP·Filed 2013·Granted Jun 24, 2014·0 cites·10 claims
- 0341US2007212556A1Curable materials containing siloxaneMUSA OSAMA M·Filed 2006·Application pending·0 cites
- 0440US8546485B2Photocurable dicing die bonding tapeHENKEL CORP·Filed 2013·Granted Oct 1, 2013·0 cites·3 claims
- 0539US2014290843A1Method of preparing an adhesive film into a precut semiconductor wafer shape on a dicing tapeHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 0637US2005238881A1Semiconductor assembly using dual-cure die attach adhesiveBECKER KEVIN H·Filed 2005·Application pending·0 cites
- 0732US2017226378A1Method for Manufacturing an Optical Semiconductor Device and a Silicone Resin Composition ThereforHenkel IP & Holding GmbH·Filed 2017·Application pending·0 cites
- 0830US2003129438A1Dual cure B-stageable adhesive for die attachFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →