Inventor · disambiguated record
Eric Salvas
Also filed as: SALVAS ERIC
14 granted patents·77 citations·filing 2009–2018
91Inventor score
Top patents by PatentIndex Score
14 records- 0192US9257308B2Thermal interface material on packageIBM·Filed 2015·Granted Feb 9, 2016·7 cites·3 claims
- 0292US9257307B2Thermal interface material on packageIBM·Filed 2015·Granted Feb 9, 2016·7 cites·4 claims
- 0392US9252029B2Thermal interface material on packageIBM·Filed 2015·Granted Feb 2, 2016·7 cites·5 claims
- 0492US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0592US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0690US9941184B2Thermal interface material on packageIBM·Filed 2017·Granted Apr 10, 2018·4 cites·19 claims
- 0772US9881848B2Thermal interface material on packageIBM·Filed 2015·Granted Jan 30, 2018·1 cites·20 claims
- 0867US8614900B2Grounded lid for micro-electronic assembliesBEAUMIER MARTIN·Filed 2011·Granted Dec 24, 2013·4 cites·18 claims
- 0963US10896862B2Thermal interface material on packageIBM·Filed 2018·Granted Jan 19, 2021·0 cites·19 claims
- 1058US9761505B2Thermal interface material on packageIBM·Filed 2015·Granted Sep 12, 2017·0 cites·11 claims
- 1158US9646913B2Thermal interface material on packageIBM·Filed 2015·Granted May 9, 2017·0 cites·5 claims
- 1258US9576878B2Thermal interface material on packageIBM·Filed 2015·Granted Feb 21, 2017·0 cites·8 claims
- 1358US9252121B2Thermal interface material on packageIBM·Filed 2014·Granted Feb 2, 2016·0 cites·1 claims
- 1449US9042120B2Grounded lid for micro-electronic assembliesIBM·Filed 2013·Granted May 26, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →