Inventor · disambiguated record
Jennifer V. Muncy
Also filed as: MUNCY JENNIFER · MUNCY JENNIFER V
15 granted patents·4 pending applications·127 citations·filing 2006–2014
93Inventor score
Top patents by PatentIndex Score
19 records- 0193US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0292US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0392US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0491US8647445B1Process for cleaning semiconductor devices and/or tooling during manufacturing thereofIBM·Filed 2012·Granted Feb 11, 2014·12 cites·17 claims
- 0590US8618036B2Aqueous cerium-containing solution having an extended bath lifetime for removing mask materialAFZALI-ARDAKANI ALI·Filed 2011·Granted Dec 31, 2013·11 cites·23 claims
- 0679US7855430B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Dec 21, 2010·4 cites·6 claims
- 0779US7777301B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Aug 17, 2010·4 cites·9 claims
- 0876US7917328B2Tracking thermal mini-cycle stressIBM·Filed 2008·Granted Mar 29, 2011·8 cites·20 claims
- 0973US9058976B2Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereofIBM·Filed 2012·Granted Jun 16, 2015·2 cites·6 claims
- 1072US8659119B2Electronic components on trenched substrates and method of forming sameKHARMA VIJAYESHWAR D·Filed 2010·Granted Feb 25, 2014·3 cites·20 claims
- 1168US8214658B2Enhanced thermal management for improved module reliabilityCASEY JON A·Filed 2008·Granted Jul 3, 2012·4 cites·22 claims
- 1264US8806742B2Method of making an electronic packageCOHEN ERWIN B·Filed 2009·Granted Aug 19, 2014·3 cites·1 claims
- 1359US9508789B2Electronic components on trenched substrates and method of forming sameGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 29, 2016·0 cites·20 claims
- 1459US8786059B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2012·Granted Jul 22, 2014·1 cites·17 claims
- 1556US8236615B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2009·Granted Aug 7, 2012·1 cites·9 claims
- 1654US2008205023A1Electronic components on trenched substrates and method of forming sameIBM·Filed 2007·Application pending·0 cites
- 1754US2015024989A1Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereofIBM·Filed 2014·Application pending·0 cites
- 1843US2013167883A1Method and device to enable semiconductor processing in solution that generates particlesFITZSIMMONS JOHN A·Filed 2012·Application pending·0 cites
- 1942US2008061448A1System and method for thermal expansion pre-compensated package substrateIBM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →