Inventor · disambiguated record
Hideharu Kobashi
Also filed as: KOBASHI HIDEHARU
5 granted patents·5 pending applications·4 citations·filing 2007–2025
67Inventor score
Files withFASFORD TECH CO LTD4RENESAS ELECTRONICS CORP3HITACHI HIGH TECH INSTR CO LTD2KOBASHI HIDEHARU1
Top patents by PatentIndex Score
10 records- 0172US7824932B2Fabrication method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 2, 2010·4 cites·12 claims
- 0270US2025253169A1Die Bonding Apparatus and Manufacturing Method for Semiconductor ApparatusFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 0362US12327739B2Die bonding apparatus and manufacturing method for semiconductor apparatusFASFORD TECH CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·7 claims
- 0452US8574933B2Fabrication method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 5, 2013·0 cites·13 claims
- 0551US2023215770A1Semiconductor manufacturing apparatus, inspection apparatus, and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Application pending·0 cites
- 0649US2008057599A1Fabrication method of semiconductor deviceKOBASHI HIDEHARU·Filed 2007·Application pending·0 cites
- 0748US8367433B2Fabrication method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 5, 2013·0 cites·5 claims
- 0843US11692947B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 0939US2014265094A1Die bonder and bonding head device of the same, and also collet position adjusting methodHITACHI HIGH TECH INSTR CO LTD·Filed 2013·Application pending·0 cites
- 1036US2014078289A1Die Bonder and Method of Position Recognition of DieHITACHI HIGH TECH INSTR CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →