Inventor · disambiguated record
Yoshinori Hosokawa
Also filed as: HOSOKAWA YOSHINORI
12 granted patents·2 pending applications·455 citations·filing 1975–2012
93Inventor score
Top patents by PatentIndex Score
14 records- 0196US4521905AMonitor of an X-ray radiation rangeHORIBA LTD·Filed 1983·Granted Jun 4, 1985·133 cites·1 claims
- 0282US4037109ASample cellHORIBA LTD·Filed 1975·Granted Jul 19, 1977·43 cites·4 claims
- 0380US4916720AX-ray analyzerHORIBA LTD·Filed 1988·Granted Apr 10, 1990·42 cites·14 claims
- 0473US5740223AFluorescent X-ray analyzer with sealed X-ray shield wallHORIBA LTD·Filed 1996·Granted Apr 14, 1998·51 cites·10 claims
- 0561US5247560AApparatus and method of measuring bone mineral density and bone strengthHORIBA LTD·Filed 1992·Granted Sep 21, 1993·106 cites·12 claims
- 0657US4720842AApparatus for detecting nickel/vanadium contained in oilHORIBA LTD·Filed 1986·Granted Jan 19, 1988·18 cites·5 claims
- 0757US4691793AApparatus for detecting amount of liquid nitrogenHORIBA LTD·Filed 1985·Granted Sep 8, 1987·16 cites·2 claims
- 0852US5398274AFluorescent x-ray analyzer and monitoring system for increasing operative lifeHORIBA LTD·Filed 1993·Granted Mar 14, 1995·17 cites·11 claims
- 0951US4016419ANon-dispersive X-ray fluorescence analyzerHORIBA LTD·Filed 1975·Granted Apr 5, 1977·12 cites·3 claims
- 1046US2006208201A1Apparatus and method for substrate neutralization and glass substrate charging preventionOMRON TATEISI ELECTRONICS CO·Filed 2006·Application pending·0 cites
- 1145US2013195244A1X-Ray InspectorX RAY INSPECTOR·Filed 2012·Application pending·0 cites
- 1240US4692935AAutomatic steel analysis apparatusHORIBA LTD·Filed 1985·Granted Sep 8, 1987·12 cites·4 claims
- 1337US4510610AExtractive furnace for extracting gaseous components from material samplesHORIBA LTD·Filed 1983·Granted Apr 9, 1985·5 cites·7 claims
- 1430US6426770B1Apparatus for inspecting face plate for color CRTHORIBA LTD·Filed 1999·Granted Jul 30, 2002·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →