Inventor · disambiguated record
Te-Sung Wu
Also filed as: WU TE-SUNG
8 granted patents·1 pending application·494 citations·filing 1994–2013
89Inventor score
Top patents by PatentIndex Score
9 records- 0196US6362087B1Method for fabricating a microelectronic fabrication having formed therein a redistribution structureAPTOS CORP·Filed 2000·Granted Mar 26, 2002·289 cites·15 claims
- 0288US5619791AMethod for fabricating highly conductive viasLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 15, 1997·108 cites·6 claims
- 0384US6448171B1Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondabilityAPTOS CORP·Filed 2000·Granted Sep 10, 2002·43 cites·11 claims
- 0468US6784089B2Flat-top bumping structure and preparation methodAPTOS CORP·Filed 2003·Granted Aug 31, 2004·18 cites·28 claims
- 0567US8492242B2Dry flux bonding device and methodFAY OWEN·Filed 2010·Granted Jul 23, 2013·3 cites·22 claims
- 0659US5779873AElectroplating of nickel on nickel ferrite devicesLUCENT TECHNOLOGIES INC·Filed 1996·Granted Jul 14, 1998·13 cites·8 claims
- 0750US5618611AMetallization of ferrites through surface reductionLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 8, 1997·11 cites·7 claims
- 0849US2013299868A1Dry flux bonding device and methodMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 0942US6524645B1Process for the electroless deposition of metal on a substrateAGERE SYSTEMS INC·Filed 1994·Granted Feb 25, 2003·9 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →