Inventor · disambiguated record
Joerg-Eric Sagmeister
Also filed as: Sagmeister Joerg-Eric
2 granted patents·0 citations·filing 2015–2018
26Inventor score
Technology areasH05K
Files withIBM2
Top patents by PatentIndex Score
2 records- 0157US11096290B2Printed circuit board with edge soldering for high-density packages and assembliesIBM·Filed 2018·Granted Aug 17, 2021·0 cites·11 claims
- 0251US10098241B2Printed circuit board with edge soldering for high-density packages and assembliesIBM·Filed 2015·Granted Oct 9, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →