Inventor · disambiguated record
Sergio Grunder
Also filed as: GRUNDER SERGIO
10 granted patents·23 pending applications·15 citations·filing 2012–2024
83Inventor score
Files withDDP SPECIALTY ELECTRONIC MATERIALS US LLC18DOW GLOBAL TECHNOLOGIES LLC9DDP SPECIALTY ELECTRONIC MAT US INC3DDP SPECIALTY ELECTRONICS MAT US INC1DDP SPECIALTY ELECTRONICS MAT US LLC1
Top patents by PatentIndex Score
33 records- 0193US10479916B2Latent two-part polyurethane adhesives curable with infrared radiationDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Nov 19, 2019·4 cites·20 claims
- 0288US11859109B2Primerless polyurethane adhesive compositionsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Jan 2, 2024·2 cites·14 claims
- 0387US11814552B2Latent two-part polyurethane adhesivesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Nov 14, 2023·2 cites·15 claims
- 0487US2024110085A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0585US2024327689A1Polypropylene bonding adhesive and processDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0682US2024343958A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0780US9688807B2Epoxy resin system containing polyethylene tetraamines for resin transfer molding processesDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Granted Jun 27, 2017·3 cites·11 claims
- 0880US9321880B2Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processesDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Granted Apr 26, 2016·3 cites·18 claims
- 0978US10450486B2Dual cure 1K PU adhesive formulations using matrix encapsulated polyaminesDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Oct 22, 2019·1 cites·4 claims
- 1073US2021009871A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2020·Application pending·0 cites
- 1172US2025092182A1Two-part interface materials, systems including the interface material, and methods thereofDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 1268US2021122955A1Polypropylene bonding adhesive and processDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Application pending·0 cites
- 1367US2020181404A1Blocked polyurethane tougheners for epoxy adhesivesDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2020·Application pending·0 cites
- 1467US2024287364A1One-component polyurethane adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2022·Application pending·0 cites
- 1566US2024425733A1Two-component polyurethane adhesiveDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2022·Application pending·0 cites
- 1666US2024391230A1Adhesive systemDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2022·Application pending·0 cites
- 1765US2020407611A1Adhesive compositionDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2019·Application pending·0 cites
- 1863US2018258329A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 1960US2023323174A1Thermal interface materialDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 2059US12134716B2Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Nov 5, 2024·0 cites·12 claims
- 2159US2018251633A1Blocked polyurethane tougheners for epoxy adhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 2256US2022411625A1Epoxy based thermal interface materialDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 2354US2022228045A1Accelerate cure polyurethane adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 2454US2022213249A1Two-part interface materials, systems including the interface material, and methods thereofDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 2553US2022411631A1Polyurethane based thermal interface material comprising silane terminated urethane prepolymersDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 2652US10023687B2Epoxy systems employing triethylaminetetraamine and tin catalystsDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Jul 17, 2018·0 cites·9 claims
- 2750US2023060754A1Thermal interface material comprising multimodally distributed spherical fillersDDP SPECIALTY ELECTRONICS MAT US LLC·Filed 2021·Application pending·0 cites
- 2848US10414857B2Epoxy resin systemDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Sep 17, 2019·0 cites·11 claims
- 2948US10023686B2Fast curing high glass transition temperature epoxy resin systemDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Jul 17, 2018·0 cites·11 claims
- 3045US2020131414A1Three-component polyurethane adhesive compositionsDDP SPECIALTY ELECTRONICS MAT US INC·Filed 2018·Application pending·0 cites
- 3143US2022251331A1Thermal interface materialsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 3242US2022209324A1Polyurethane based thermal interface materialDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 3341US2013122297A1Molecular gauge blocks for building on the nanoscaleUNIV NORTHWESTERN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →