Inventor · disambiguated record
Raymond T. Galasco
Also filed as: GALASCO RAYMOND T · GALASCO RAYMOND THOMAS
23 granted patents·1 pending application·591 citations·filing 1983–2006
96Inventor score
Top patents by PatentIndex Score
24 records- 0199US7463474B2System and method of plating ball grid array and isolation features for electronic componentsAVX CORP·Filed 2006·Granted Dec 9, 2008·171 cites·27 claims
- 0295US6600224B1Thin film attachment to laminate using a dendritic interconnectionIBM·Filed 2000·Granted Jul 29, 2003·83 cites·19 claims
- 0392US7576968B2Plated terminations and method of forming using electrolytic platingAVX CORP·Filed 2006·Granted Aug 18, 2009·31 cites·37 claims
- 0486US4479852AMethod for determination of concentration of organic additive in plating bathIBM·Filed 1983·Granted Oct 30, 1984·51 cites·22 claims
- 0585US6815126B2Printed wiring board with conformally plated circuit tracesIBM·Filed 2002·Granted Nov 9, 2004·30 cites·7 claims
- 0681US6626196B2Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processingIBM·Filed 2001·Granted Sep 30, 2003·23 cites·17 claims
- 0780US6522014B1Fabrication of a metalized blind viaIBM·Filed 2000·Granted Feb 18, 2003·23 cites·20 claims
- 0876US5432998AMethod of solder bonding processor packageIBM·Filed 1993·Granted Jul 18, 1995·40 cites·1 claims
- 0975US6176985B1Laminated electroplating rack and connection system for optimized platingIBM·Filed 1998·Granted Jan 23, 2001·29 cites·16 claims
- 1072US6924224B2Method of forming filled blind viasIBM·Filed 2003·Granted Aug 2, 2005·16 cites·22 claims
- 1171US6852152B2Colloidal seed formulation for printed circuit board metallizationIBM·Filed 2002·Granted Feb 8, 2005·12 cites·14 claims
- 1260US7084509B2Electronic package with filled blinds viasIBM·Filed 2002·Granted Aug 1, 2006·8 cites·9 claims
- 1357US4540473ACopper plating bath having increased plating rate, and methodIBM·Filed 1983·Granted Sep 10, 1985·10 cites·16 claims
- 1456US6576549B2Fabrication of a metalized blind viaIBM·Filed 2002·Granted Jun 10, 2003·5 cites·23 claims
- 1550US2005042383A1Colloidal seed formation for printed circuit board metallizationIBM·Filed 2004·Application pending·0 cites
- 1647US6518509B1Copper plated invar with acid precleanIBM·Filed 1999·Granted Feb 11, 2003·12 cites·10 claims
- 1747US5374338ASelective electroetch of copper and other metalsIBM·Filed 1993·Granted Dec 20, 1994·10 cites·10 claims
- 1845US5939786AUniform plating of dendritesIBM·Filed 1996·Granted Aug 17, 1999·10 cites·5 claims
- 1944US7378227B2Method of making a printed wiring board with conformally plated circuit tracesIBM·Filed 2004·Granted May 27, 2008·0 cites·18 claims
- 2043US6935018B2Copper plated invar with acid precleanIBM·Filed 2002·Granted Aug 30, 2005·1 cites·42 claims
- 2143US6043150AMethod for uniform plating of dendritesIBM·Filed 1999·Granted Mar 28, 2000·9 cites·11 claims
- 2242US6179990B1Biased acid cleaning of a copper-invar-copper laminateIBM·Filed 1999·Granted Jan 30, 2001·9 cites·18 claims
- 2338US6228246B1Removal of metal skin from a copper-Invar-copper laminateIBM·Filed 1999·Granted May 8, 2001·7 cites·45 claims
- 2428US5472735AMethod for forming electrical connection to the inner layers of a multilayer circuit boardIBM·Filed 1994·Granted Dec 5, 1995·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →