Inventor · disambiguated record
Yusaku Shimizu
Also filed as: Shimizu yusaku
7 granted patents·7 pending applications·5 citations·filing 2012–2021
72Inventor score
Top patents by PatentIndex Score
14 records- 0176US10688395B2Storage medium having stored therein information processing program, information processing apparatus, information processing system, and information processing methodNINTENDO CO LTD·Filed 2019·Granted Jun 23, 2020·3 cites·19 claims
- 0267US8912669B2Sealing resin sheet, method for producing electronic component package and electronic component packageNITTO DENKO CORP·Filed 2013·Granted Dec 16, 2014·2 cites·10 claims
- 0352US10297470B2Resin sheet for sealing electronic device and method for manufacturing electronic-device packageNITTO DENKO CORP·Filed 2014·Granted May 21, 2019·0 cites·12 claims
- 0447US2014106133A1LaminateNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0546US11209974B2Storage medium having stored therein information processing program, information processing apparatus, information processing system, and information processing method for determining a correction offset for a dragged objectNINTENDO CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·21 claims
- 0645US10639545B2Game system, game program, information processing device, and information processing methodNINTENDO CO LTD·Filed 2017·Granted May 5, 2020·0 cites·27 claims
- 0745US2021187587A1Bottle can manufacturing apparatus and bottle can manufacturing methodTOYO SEIKAN KAISHA LTD·Filed 2018·Application pending·0 cites
- 0843US2016060450A1Sealing sheet, method for manufacturing sealing sheet, and method for manufacturing electronic component packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0941US2013185934A1Resin composition sheet for encapsulating electronic parts and method of producing electronic part apparatus using the sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1041US2013183469A1Resin sheet for hollow encapsulation and production method for the sheet, and production method for hollow electronic part apparatus and hollow electronic part apparatusNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1140US2013157419A1Method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1239US9147625B2Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Sep 29, 2015·0 cites·18 claims
- 1337US11850510B2Storage medium having stored therein information processing program, information processing apparatus, information processing system, and information processing methodNINTENDO CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·25 claims
- 1437US2014042645A1Resin sheet for sealing electronic component, resin-sealed type semiconductor device and method for producing resin-sealed type semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →