Inventor · disambiguated record
Herbert Keppner
Also filed as: KEPPNER HERBERT
11 granted patents·2 pending applications·356 citations·filing 1994–2020
91Inventor score
Files withHOGG ANDREAS3ALUSUISSE LONZA SERVICES AG1CODMAN & SHURTLEFF1ETHICON ENDO SURGERY INC1ETHICON LLC1
Top patents by PatentIndex Score
13 records- 0192US5589008APhotovoltaic cell and method for fabrication of said cellUNIV NEUCHATEL·Filed 1994·Granted Dec 31, 1996·122 cites·30 claims
- 0291US9737735B2Ultrasonic surgical apparatus with silicon waveguideETHICON ENDO SURGERY INC·Filed 2013·Granted Aug 22, 2017·76 cites·40 claims
- 0387US9345813B2Three dimensional packaging for medical implantsHOGG ANDREAS·Filed 2012·Granted May 24, 2016·35 cites·16 claims
- 0484US6124039ACoating substrateALUSUISSE LONZA SERVICES AG·Filed 1997·Granted Sep 26, 2000·84 cites·25 claims
- 0580US8313819B2Ultra-thin multi-layer packagingHOGG ANDREAS·Filed 2010·Granted Nov 20, 2012·6 cites·13 claims
- 0675US8361591B2Packaging with active protection layerMEDOS INT SARL·Filed 2010·Granted Jan 29, 2013·5 cites·17 claims
- 0774US8313811B2Plasma enhanced polymer ultra-thin multi-layer packagingHOGG ANDREAS·Filed 2010·Granted Nov 20, 2012·5 cites·11 claims
- 0867US7036369B2Thermal flow sensor having recesses in a substrateCODMAN & SHURTLEFF·Filed 2004·Granted May 2, 2006·16 cites·30 claims
- 0965US8092892B2Method for producing a plastic membrane device and the thus obtained deviceKEPPNER HERBERT·Filed 2005·Granted Jan 10, 2012·7 cites·23 claims
- 1060US10279085B2Three dimensional packaging for medical implantsIntegra LifeSciences Switzerland Sarl·Filed 2014·Granted May 7, 2019·0 cites·21 claims
- 1159US2017151708A1Ultrasonic surgical apparatus with silicon waveguideETHICON LLC·Filed 2017·Application pending·0 cites
- 1249US12098459B2Promoting adhesion of thin filmsSY&SE SA·Filed 2020·Granted Sep 24, 2024·0 cites·13 claims
- 1330US2004112425A1Photovoltaic product and process of fabrication thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →