Inventor · disambiguated record
Domingo Figueredo
Also filed as: FIGUEREDO DOMINGO · FIGUEREDO DOMINGO A
24 granted patents·1,324 citations·filing 1990–2024
97Inventor score
Files withHEWLETT PACKARD CO7AGILENT TECHNOLOGIES INC6AVAGO TECH INT SALES PTE LID5AVAGO TECHNOLOGIES GENERAL IP2MENLO IND INC2
Top patents by PatentIndex Score
24 records- 0199US6472954B1Controlled effective coupling coefficients for film bulk acoustic resonatorsAGILENT TECHNOLOGIES INC·Filed 2001·Granted Oct 29, 2002·270 cites·10 claims
- 0298US6828713B2Resonator with seed layerAGILENT TECHNOLOGIES INC·Filed 2002·Granted Dec 7, 2004·235 cites·13 claims
- 0398US6714102B2Method of fabricating thin film bulk acoustic resonator (FBAR) and FBAR structure embodying the methodAGILENT TECHNOLOGIES INC·Filed 2001·Granted Mar 30, 2004·138 cites·16 claims
- 0498US6710681B2Thin film bulk acoustic resonator (FBAR) and inductor on a monolithic substrate and method of fabricating the sameAGILENT TECHNOLOGIES INC·Filed 2001·Granted Mar 23, 2004·145 cites·13 claims
- 0595US5883650AThin-film printhead device for an ink-jet printerHEWLETT PACKARD CO·Filed 1995·Granted Mar 16, 1999·114 cites·15 claims
- 0690US6787897B2Wafer-level package with silicon gasketAGILENT TECHNOLOGIES INC·Filed 2001·Granted Sep 7, 2004·65 cites·13 claims
- 0787US5093692ATunnel diode detector for microwave frequency applicationsMENLO IND INC·Filed 1990·Granted Mar 3, 1992·75 cites·26 claims
- 0884US5225369ATunnel diode detector for microwave frequency applicationsMENLO IND INC·Filed 1991·Granted Jul 6, 1993·61 cites·16 claims
- 0983US6979597B2Wafer-level package with silicon gasketAGILENT TECHNOLOGIES INC·Filed 2003·Granted Dec 27, 2005·32 cites·12 claims
- 1082US10177736B2Bulk acoustic wave resonator comprising multiple acoustic reflectorsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jan 8, 2019·4 cites·23 claims
- 1177US6155674AStructure to effect adhesion between substrate and ink barrier in ink jet printheadHEWLETT PACKARD CO·Filed 1997·Granted Dec 5, 2000·37 cites·27 claims
- 1277US6153114AThin-film printhead device for an ink-jet printerHEWLETT PACKARD CO·Filed 1998·Granted Nov 28, 2000·30 cites·12 claims
- 1374US6286939B1Method of treating a metal surface to increase polymer adhesionHEWLETT PACKARD CO·Filed 1997·Granted Sep 11, 2001·32 cites·16 claims
- 1472US12489042B2Device having solder bump structure for improved mechanical, electrical, and/or thermal performanceAVAGO TECH INT SALES PTE LID·Filed 2024·Granted Dec 2, 2025·0 cites·19 claims
- 1572US11018651B2Bulk acoustic wave resonators having doped piezoelectric material and an adhesion and diffusion barrier layerAVAGO TECH INT SALES PTE LID·Filed 2018·Granted May 25, 2021·2 cites·24 claims
- 1670US10141268B2Circuit package with internal and external shieldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 27, 2018·2 cites·20 claims
- 1769US12113032B2Substrate having undercut portion for stress mitigationAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1868US6209991B1Transition metal carbide films for applications in ink jet printheadsHEWLETT PACKARD CO·Filed 1997·Granted Apr 3, 2001·25 cites·24 claims
- 1967US6441838B1Method of treating a metal surface to increase polymer adhesionHEWLETT PACKARD CO·Filed 2001·Granted Aug 27, 2002·11 cites·22 claims
- 2063US6758552B1Integrated thin-film drive head for thermal ink-jet printerHEWLETT PACKARD DEVELOPMENT CO·Filed 1995·Granted Jul 6, 2004·21 cites·19 claims
- 2162US12002741B2Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengthsAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Jun 4, 2024·0 cites·11 claims
- 2259US6239820B1Thin-film printhead device for an ink-jet printerHEWLETT PACKARD CO·Filed 1998·Granted May 29, 2001·18 cites·3 claims
- 2358US11276650B2Stress mitigation structureAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 2434US5257005ASmall value precision integrated circuit resistorsDESROCHES ALAN R·Filed 1992·Granted Oct 26, 1993·7 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →