Inventor · disambiguated record
Kashmir Sahota
Also filed as: SAHOTA KASHMIR · SAHOTA KASHMIR S · SAHOTA KASHMIR SINGH
42 granted patents·2 pending applications·1,029 citations·filing 1989–2012
98Inventor score
Top patents by PatentIndex Score
44 records- 0195US6004862ACore array and periphery isolation techniqueADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 21, 1999·219 cites·8 claims
- 0294US7449413B1Method for effectively removing polysilicon nodule defectsADVANCED MICRO DEVICES INC·Filed 2006·Granted Nov 11, 2008·26 cites·10 claims
- 0389US5923993AMethod for fabricating dishing free shallow isolation trenchesADVANCED MICRO DEVICES INC·Filed 1997·Granted Jul 13, 1999·110 cites·16 claims
- 0488US6720264B2Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting propertiesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 13, 2004·45 cites·15 claims
- 0584US5665199AMethodology for developing product-specific interlayer dielectric polish processesADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 9, 1997·78 cites·24 claims
- 0683US6613646B1Methods for reduced trench isolation step heightADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 2, 2003·29 cites·26 claims
- 0783US6184141B1Method for multiple phase polishing of a conductive layer in a semidonductor waferADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 6, 2001·64 cites·28 claims
- 0882US6503418B2Ta barrier slurry containing an organic additiveADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 7, 2003·52 cites·51 claims
- 0981US6927113B1Semiconductor component and method of manufactureADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 9, 2005·31 cites·24 claims
- 1079US6294460B1Semiconductor manufacturing method using a high extinction coefficient dielectric photomaskADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 25, 2001·28 cites·14 claims
- 1178US5998301AMethod and system for providing tapered shallow trench isolation structure profileADVANCED MICRO DEVICES INC·Filed 1997·Granted Dec 7, 1999·51 cites·12 claims
- 1274US7077728B1Method for reducing edge array erosion in a high-density arrayADVANCED MICRO DEVICES INC·Filed 2005·Granted Jul 18, 2006·4 cites·12 claims
- 1372US7307002B2Non-critical complementary masking method for poly-1 definition in flash memory device fabricationSPANSION LLC·Filed 2005·Granted Dec 11, 2007·4 cites·10 claims
- 1470US5665201AHigh removal rate chemical-mechanical polishingADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 9, 1997·38 cites·33 claims
- 1568US6410443B1Method for removing semiconductor ARC using ARC CMP buffingADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 25, 2002·12 cites·31 claims
- 1668US4992134ADopant-independent polysilicon plasma etchADVANCED MICRO DEVICES INC·Filed 1989·Granted Feb 12, 1991·32 cites·12 claims
- 1767US6380067B1Method for creating partially UV transparent anti-reflective coating for semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 30, 2002·11 cites·11 claims
- 1867US6348406B1Method for using a low dielectric constant layer as a semiconductor anti-reflective coatingADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 19, 2002·11 cites·16 claims
- 1967US6136649AMethod for removing anti-reflective coating layer using plasma etch process after contact CMPADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 24, 2000·32 cites·20 claims
- 2066US6413869B1Dielectric protected chemical-mechanical polishing in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 2, 2002·10 cites·20 claims
- 2165US6359307B1Method for forming self-aligned contacts and interconnection lines using dual damascene techniquesADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 19, 2002·13 cites·5 claims
- 2259US6133619AReduction of silicon oxynitride film delamination in integrated circuit inter-level dielectricsADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 17, 2000·24 cites·6 claims
- 2358US6773988B1Memory wordline spacerADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 10, 2004·5 cites·14 claims
- 2458US6124640AScalable and reliable integrated circuit inter-level dielectricADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 26, 2000·21 cites·14 claims
- 2557US6569747B1Methods for trench isolation with reduced step heightADVANCED MICRO DEVICES INC·Filed 2002·Granted May 27, 2003·7 cites·17 claims
- 2657US6217418B1Polishing pad and method for polishing porous materialsADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 17, 2001·17 cites·17 claims
- 2756US6770523B1Method for semiconductor wafer planarization by CMP stop layer formationADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·5 cites·20 claims
- 2854US6291296B1Method for removing anti-reflective coating layer using plasma etch process before contact CMPADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 18, 2001·18 cites·24 claims
- 2953US6518185B1Integration scheme for non-feature-size dependent cu-alloy introductionADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 11, 2003·5 cites·12 claims
- 3052US6376389B1Method for eliminating anti-reflective coating in semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 23, 2002·5 cites·8 claims
- 3151US7208382B1Semiconductor device with high conductivity region using shallow trenchADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 24, 2007·4 cites·14 claims
- 3251US7052969B1Method for semiconductor wafer planarization by isolation material growthADVANCED MICRO DEVICES INC·Filed 2002·Granted May 30, 2006·4 cites·18 claims
- 3350US8384146B2Methods for forming a memory cell having a top oxide spacerSPANSION LLC·Filed 2012·Granted Feb 26, 2013·0 cites·13 claims
- 3449US7141502B1Slurry-less polishing for removal of excess interconnect material during fabrication of a silicon integrated circuitADVANCED MICRO DEVICES INC·Filed 2003·Granted Nov 28, 2006·2 cites·8 claims
- 3547US8202779B2Methods for forming a memory cell having a top oxide spacerFANG SHENQING·Filed 2010·Granted Jun 19, 2012·0 cites·7 claims
- 3646US2007166938A1Semiconductor device with high conductivity region using shallow trenchADVANCED MICRO DEVICES INC·Filed 2007·Application pending·0 cites
- 3744US6699785B2Conductor abrasiveless chemical-mechanical polishing in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 2, 2004·1 cites·10 claims
- 3843US7358191B1Method for decreasing sheet resistivity variations of an interconnect metal layerSPANSION LLC·Filed 2006·Granted Apr 15, 2008·0 cites·19 claims
- 3943US6723605B1Method for manufacturing memory with high conductivity bitline and shallow trench isolation integrationADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 20, 2004·5 cites·21 claims
- 4040US7053446B1Memory wordline spacerADVANCED MICRO DEVICES INC·Filed 2004·Granted May 30, 2006·0 cites·10 claims
- 4137US7294573B1Method for controlling poly 1 thickness and uniformity in a memory array fabrication processSPANSION LLC·Filed 2005·Granted Nov 13, 2007·0 cites·18 claims
- 4237US6426297B1Differential pressure chemical-mechanical polishing in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 30, 2002·0 cites·10 claims
- 4337US5840623AEfficient and economical method of planarization of multilevel metallization structures in integrated circuits using CMPADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 24, 1998·6 cites·12 claims
- 4436US2002173140A1Conductor chemical-mechanical polishing in integrated circuit interconnectsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →