Inventor · disambiguated record
Mitsuo Hori
Also filed as: HORI MITSUO
10 granted patents·3 pending applications·188 citations·filing 1997–2014
89Inventor score
Top patents by PatentIndex Score
13 records- 0194US6202702B1Acoustic damping pipe coverSHISHIAI KK·Filed 2000·Granted Mar 20, 2001·96 cites·6 claims
- 0288US6515211B2Music performance assistance apparatus for indicating how to perform chord and computer program thereforYAMAHA CORP·Filed 2002·Granted Feb 4, 2003·49 cites·16 claims
- 0369US7532994B2Test apparatus, test method, electronic device manufacturing method, test simulator and test simulation methodADVANTEST CORP·Filed 2006·Granted May 12, 2009·6 cites·29 claims
- 0468US6635327B2Energy conversion compositionSHISHIAI KK·Filed 2001·Granted Oct 21, 2003·12 cites·37 claims
- 0564US7506291B2Test emulator, emulation program and method for manufacturing semiconductor deviceADVANTEST CORP·Filed 2005·Granted Mar 17, 2009·3 cites·17 claims
- 0663US7502724B2Test simulator, test simulation program and recording mediumADVANTEST CORP·Filed 2005·Granted Mar 10, 2009·3 cites·15 claims
- 0761US7269773B2Test program debugger device, semiconductor test apparatus, test program debugging method and test methodADVANTEST CORP·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 0857US2014134387A1MatDAIWA KK·Filed 2014·Application pending·0 cites
- 0949US9610656B2Lead-free solder alloy for vehicle glassNISHI MIZUKI·Filed 2012·Granted Apr 4, 2017·0 cites·1 claims
- 1049US7346651B2Method of searching information site by item keyword and action keywordYAMAHA CORP·Filed 2001·Granted Mar 18, 2008·1 cites·18 claims
- 1143US2009325446A1Organic damping materialR & D LLC AS·Filed 2009·Application pending·0 cites
- 1238US6645586B2Energy conversion compositionSHISHIAI KK·Filed 1997·Granted Nov 11, 2003·15 cites·62 claims
- 1337US2011180311A1Solder, electronic part, and method of fabricating electronic partNIHON DEMPA KOGYO CO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →