Inventor · disambiguated record
William T. Motsiff
Also filed as: MOTSIFF WILLIAM · MOTSIFF WILLIAM T · MOTSIFF WILLIAM THOMAS
67 granted patents·4 pending applications·1,819 citations·filing 1983–2008
99Inventor score
Top patents by PatentIndex Score
71 records- 0199US7071532B2Adjustable self-aligned air gap dielectric for low capacitance wiringIBM·Filed 2003·Granted Jul 4, 2006·243 cites·15 claims
- 0298US5883435APersonalization structure for semiconductor devicesIBM·Filed 1996·Granted Mar 16, 1999·316 cites·11 claims
- 0396US7335577B2Crack stop for low K dielectricsIBM·Filed 2005·Granted Feb 26, 2008·47 cites·9 claims
- 0495US6498056B1Apparatus and method for antifuse with electrostatic assistIBM·Filed 2000·Granted Dec 24, 2002·69 cites·17 claims
- 0593US7521336B2Crack stop for low K dielectricsIBM·Filed 2007·Granted Apr 21, 2009·22 cites·6 claims
- 0688US7358148B2Adjustable self-aligned air gap dielectric for low capacitance wiringIBM·Filed 2006·Granted Apr 15, 2008·14 cites·4 claims
- 0788US6773952B2Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfacesIBM·Filed 2002·Granted Aug 10, 2004·45 cites·12 claims
- 0888US6440834B2Method and structure for a semiconductor fuseIBM·Filed 2001·Granted Aug 27, 2002·44 cites·29 claims
- 0986US6844609B2Antifuse with electrostatic assistIBM·Filed 2002·Granted Jan 18, 2005·30 cites·14 claims
- 1086US6498385B1Post-fuse blow corrosion prevention structure for copper fusesIBM·Filed 1999·Granted Dec 24, 2002·68 cites·11 claims
- 1184US6958540B2Dual damascene interconnect structures having different materials for line and via conductorsIBM·Filed 2003·Granted Oct 25, 2005·29 cites·6 claims
- 1284US6667533B2Triple damascene fuseIBM·Filed 2002·Granted Dec 23, 2003·31 cites·30 claims
- 1384US6512292B1Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfacesIBM·Filed 2000·Granted Jan 28, 2003·34 cites·13 claims
- 1484US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 1583US6806578B2Copper pad structureIBM·Filed 2000·Granted Oct 19, 2004·32 cites·21 claims
- 1681US7207096B2Method of manufacturing high performance copper inductors with bond padsIBM·Filed 2004·Granted Apr 24, 2007·23 cites·4 claims
- 1781US6924210B1Chip dicingIBM·Filed 2004·Granted Aug 2, 2005·23 cites·20 claims
- 1880US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 1980US5457345AMetallization composite having nickle intermediate/interfaceIBM·Filed 1994·Granted Oct 10, 1995·56 cites·11 claims
- 2079US5795819AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1997·Granted Aug 18, 1998·49 cites·2 claims
- 2178US6872648B2Reduced splattering of unpassivated laser fusesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 29, 2005·26 cites·16 claims
- 2278US6426557B1Self-aligned last-metal C4 interconnection layer for Cu technologiesIBM·Filed 2000·Granted Jul 30, 2002·26 cites·7 claims
- 2378US5719070AMetallization composite having nickel intermediate/interfaceIBM·Filed 1996·Granted Feb 17, 1998·49 cites·20 claims
- 2476US6746947B2Post-fuse blow corrosion prevention structure for copper fusesIBM·Filed 2002·Granted Jun 8, 2004·20 cites·5 claims
- 2574US6559543B1Stacked fill structures for support of dielectric layersIBM·Filed 2001·Granted May 6, 2003·18 cites·10 claims
- 2673US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 2772US6674168B1Single and multilevel reworkIBM·Filed 2003·Granted Jan 6, 2004·17 cites·20 claims
- 2872US6458630B1Antifuse for use with low k dielectric foam insulatorsIBM·Filed 1999·Granted Oct 1, 2002·33 cites·19 claims
- 2972US6093630ASemi-conductor personalization structure and methodIBM·Filed 1998·Granted Jul 25, 2000·36 cites·11 claims
- 3072US5731624AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1996·Granted Mar 24, 1998·37 cites·10 claims
- 3171US6982227B2Single and multilevel reworkIBM·Filed 2003·Granted Jan 3, 2006·16 cites·6 claims
- 3271US6798066B1Heat dissipation from IC interconnectsIBM·Filed 2003·Granted Sep 28, 2004·17 cites·24 claims
- 3368US7300867B2Dual damascene interconnect structures having different materials for line and via conductorsIBM·Filed 2005·Granted Nov 27, 2007·3 cites·12 claims
- 3468US6661106B1Alignment mark structure for laser fusing and method of useIBM·Filed 2002·Granted Dec 9, 2003·14 cites·33 claims
- 3567US6249038B1Method and structure for a semiconductor fuseIBM·Filed 1999·Granted Jun 19, 2001·28 cites·12 claims
- 3666US7981732B2Programming of laser fuseIBM·Filed 2008·Granted Jul 19, 2011·2 cites·8 claims
- 3765US8044510B2Product and method for integration of deep trench mesh and structures under a bond padIBM·Filed 2008·Granted Oct 25, 2011·2 cites·26 claims
- 3864US7482258B2Product and method for integration of deep trench mesh and structures under a bond padIBM·Filed 2005·Granted Jan 27, 2009·2 cites·22 claims
- 3964US7384824B2Structure and programming of laser fuseIBM·Filed 2006·Granted Jun 10, 2008·2 cites·5 claims
- 4062US6827868B2Thinning of fuse passivation after C4 formationIBM·Filed 2002·Granted Dec 7, 2004·10 cites·7 claims
- 4159US7704876B2Dual damascene interconnect structures having different materials for line and via conductorsIBM·Filed 2007·Granted Apr 27, 2010·1 cites·13 claims
- 4259US6492207B2Method for making a pedestal fuseIBM·Filed 2001·Granted Dec 10, 2002·7 cites·9 claims
- 4358US7064409B2Structure and programming of laser fuseIBM·Filed 2003·Granted Jun 20, 2006·6 cites·7 claims
- 4458US6261873B1Pedestal fuseIBM·Filed 1999·Granted Jul 17, 2001·19 cites·8 claims
- 4557US6375159B2High laser absorption copper fuse and method for making the sameIBM·Filed 1999·Granted Apr 23, 2002·21 cites·11 claims
- 4657US4590258APolyamic acid copolymer system for improved semiconductor manufacturingIBM·Filed 1983·Granted May 20, 1986·22 cites·10 claims
- 4756US6734047B1Thinning of fuse passivation after C4 formationIBM·Filed 2002·Granted May 11, 2004·7 cites·8 claims
- 4855US6784516B1Insulative cap for laser fusingIBM·Filed 2000·Granted Aug 31, 2004·5 cites·10 claims
- 4955US6573538B2Semiconductor device with internal heat dissipationIBM·Filed 1998·Granted Jun 3, 2003·19 cites·12 claims
- 5054US6844747B2Wafer level system for producing burn-in/screen, and reliability evaluations to be performed on all chips simultaneously without any wafer contactingIBM·Filed 2001·Granted Jan 18, 2005·6 cites·50 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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