Inventor · disambiguated record
Maria Guardado
Also filed as: GUARDADO MARIA · GUARDADO MARIA G
11 granted patents·1 pending application·133 citations·filing 1998–2002
90Inventor score
Top patents by PatentIndex Score
12 records- 0177US6382500B1Solder reflow furnace with flux effluent collector and method of preventing flux contaminationADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·33 cites·22 claims
- 0271US6603916B1Lightwave circuit assembly having low deformation balanced sandwich substrateLIGHTWAVE MICROSYSTEMS CORP·Filed 2001·Granted Aug 5, 2003·16 cites·30 claims
- 0368US6671450B2Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibersLIGHTWAVE MICROSYSTEMS CORP·Filed 2001·Granted Dec 30, 2003·14 cites·44 claims
- 0464US6617195B1Method of reflowing organic packages using no-clean fluxADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 9, 2003·12 cites·14 claims
- 0564US6409070B1Minimizing flux residue by controlling amount of moisture during reflowADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 25, 2002·14 cites·14 claims
- 0657US6103549ANo clean flux for flip chip assemblyADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 15, 2000·23 cites·6 claims
- 0753US6722553B2Controlled and programmed deposition of flux on a flip-chip die by sprayingADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 20, 2004·5 cites·10 claims
- 0852US6488158B1Boat for organic and ceramic flip chip package assemblyADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 3, 2002·5 cites·16 claims
- 0952US6468917B1Method for modifying a C4 semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 22, 2002·6 cites·5 claims
- 1036US6812570B2Organic packages having low tin solder connectionsADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 2, 2004·0 cites·17 claims
- 1135US6098867AAutomated brush fluxing system for application of controlled amount of flux to packagesADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 8, 2000·5 cites·7 claims
- 1234US2002170746A1Organic packages with solders for reliable flip chip connectionsFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →