Inventor · disambiguated record
Koki Otake
Also filed as: OTAKE KOKI
12 granted patents·735 citations·filing 1995–2012
94Inventor score
Top patents by PatentIndex Score
12 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0292US5920117ASemiconductor device and method of forming the deviceFUJITSU LTD·Filed 1997·Granted Jul 6, 1999·135 cites·12 claims
- 0386US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0485US6732911B2Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing systemFUJITSU LTD·Filed 2001·Granted May 11, 2004·35 cites·39 claims
- 0578US6271110B1Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 1998·Granted Aug 7, 2001·54 cites·8 claims
- 0677US6319810B1Method for forming solder bumpsFUJITSU LTD·Filed 1996·Granted Nov 20, 2001·55 cites·6 claims
- 0776US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 0871US5747874ASemiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1995·Granted May 5, 1998·37 cites·27 claims
- 0970US6090301AMethod for fabricating bump forming plate memberFUJITSU LTD·Filed 1997·Granted Jul 18, 2000·37 cites·5 claims
- 1069US8490857B2Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor deviceMATSUI HIROYUKI·Filed 2012·Granted Jul 23, 2013·2 cites·5 claims
- 1167US6022759AMethod for producing a semiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1998·Granted Feb 8, 2000·31 cites·8 claims
- 1248US8336756B2Reflow apparatus, a reflow method, and a manufacturing method of semiconductor deviceMATSUI HIROYUKI·Filed 2006·Granted Dec 25, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →