Inventor · disambiguated record
Shigeru Kinpara
Also filed as: KINPARA SHIGERU
5 granted patents·2 pending applications·40 citations·filing 1996–2007
77Inventor score
Top patents by PatentIndex Score
7 records- 0160US5976971AFabrication process of a semiconductor device having an interconnection structureRICOH KK·Filed 1996·Granted Nov 2, 1999·27 cites·8 claims
- 0249US7232202B2Drop discharge head and method of producing the sameRICOH KK·Filed 2002·Granted Jun 19, 2007·4 cites·13 claims
- 0346US7571984B2Drop discharge head and method of producing the sameRICOH KK·Filed 2007·Granted Aug 11, 2009·0 cites·10 claims
- 0441US2003052439A1Method for manufacturing heat-curable resin molded productFiled 2002·Application pending·0 cites
- 0537US5876543AMethod of finishing board with thick resin film for making under layer invisibleYAMAHA CORP·Filed 1997·Granted Mar 2, 1999·6 cites·10 claims
- 0632US2005039566A1Steering and production method thereforFiled 2003·Application pending·0 cites
- 0730US6468460B2Method for manufacturing heat-curable resin molded productYAMAHA CORP·Filed 1999·Granted Oct 22, 2002·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →