Inventor · disambiguated record
Hsi-Chuan Chen
Also filed as: CHEN HSI-CHUAN
27 granted patents·6 pending applications·1,147 citations·filing 1996–2020
97Inventor score
Files withVANGUARD INT SEMICONDUCT CORP13WINBOND ELECTRONICS CORP4IND TECH RES INST3CADENCE DESIGN SYSTEMS INC2ORCHID GENE LLC2
Top patents by PatentIndex Score
33 records- 0194US6249902B1Design hierarchy-based placementSILICON PERSPECTIVE CORP·Filed 1998·Granted Jun 19, 2001·451 cites·15 claims
- 0288US6046083AGrowth enhancement of hemispherical grain silicon on a doped polysilicon storage node capacitor structure, for dynamic random access memory applicationsVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Apr 4, 2000·85 cites·11 claims
- 0387US6037238AProcess to reduce defect formation occurring during shallow trench isolation formationVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Mar 14, 2000·90 cites·17 claims
- 0485US9518304B2Nicotine resistant microorganismsTYTON BIOSCIENCES LLC·Filed 2015·Granted Dec 13, 2016·2 cites·14 claims
- 0585US6651235B2Scalable, partitioning integrated circuit layout systemCADENCE DESIGN SYSTEMS INC·Filed 2001·Granted Nov 18, 2003·52 cites·32 claims
- 0684US7739630B1Optimizing a circuit designSPRINGSOFT USA INC·Filed 2007·Granted Jun 15, 2010·14 cites·24 claims
- 0783US5913119AMethod of selective growth of a hemispherical grain silicon layer on the outer sides of a crown shaped DRAM capacitor structureVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Jun 15, 1999·57 cites·23 claims
- 0880US6578183B2Method for generating a partitioned IC layoutSILICON PERSPECTIVE CORP·Filed 2001·Granted Jun 10, 2003·36 cites·21 claims
- 0979US5897352AMethod of manufacturing hemispherical grained polysilicon with improved adhesion and reduced capacitance depletionVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Apr 27, 1999·40 cites·23 claims
- 1078US6037219AOne step in situ doped amorphous silicon layers used for selective hemispherical grain silicon formation for crown shaped capacitor applicationsVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Mar 14, 2000·45 cites·27 claims
- 1175US5877052AResolution of hemispherical grained silicon peeling and row-disturb problems for dynamic random access memory, stacked capacitor structuresVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Mar 2, 1999·39 cites·27 claims
- 1274US6074931AProcess for recess-free planarization of shallow trench isolationVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Jun 13, 2000·47 cites·23 claims
- 1372US5930625AMethod for fabricating a stacked, or crown shaped, capacitor structureVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Jul 27, 1999·33 cites·19 claims
- 1469US6352896B1Method of manufacturing DRAM capacitorWINBOND ELECTRONICS CORP·Filed 2000·Granted Mar 5, 2002·13 cites·26 claims
- 1569US5658822ALocos method with double polysilicon/silicon nitride spacerVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Aug 19, 1997·37 cites·19 claims
- 1664US6194265B1Process for integrating hemispherical grain silicon and a nitride-oxide capacitor dielectric layer for a dynamic random access memory capacitor structureVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Feb 27, 2001·24 cites·24 claims
- 1764US6187627B1Lading plug contact pattern for DRAM applicationWINBOND ELECTRONICS CORP·Filed 2000·Granted Feb 13, 2001·9 cites·16 claims
- 1860US6165830AMethod to decrease capacitance depletion, for a DRAM capacitor, via selective deposition of a doped polysilicon layer on a selectively formed hemispherical grain silicon layerVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Dec 26, 2000·20 cites·18 claims
- 1957US7917881B1Timing of a circuit designSPRINGSOFT USA INC·Filed 2007·Granted Mar 29, 2011·1 cites·30 claims
- 2057US6423594B1Method of fabricating deep trench capacitorWINBOND ELECTRONICS CORP·Filed 2001·Granted Jul 23, 2002·7 cites·10 claims
- 2156US6127221AIn situ, one step, formation of selective hemispherical grain silicon layer, and a nitride-oxide dielectric capacitor layer, for a DRAM applicationVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Oct 3, 2000·17 cites·19 claims
- 2256US2017323986A1Photovoltaic moduleIND TECH RES INST·Filed 2017·Application pending·0 cites
- 2355US7155694B2Trial placement system with cloningCADENCE DESIGN SYSTEMS INC·Filed 2004·Granted Dec 26, 2006·5 cites·20 claims
- 2451US12419230B1Porous ceramic member with nano silver coating for filtering a plant growth medium and method of applicationORCHID GENE LLC·Filed 2020·Granted Sep 23, 2025·0 cites·4 claims
- 2549US6291355B1Method of fabricating a self-aligned contact openingWINDBOND ELECTRONICS CORP·Filed 1999·Granted Sep 18, 2001·16 cites·11 claims
- 2649US2015127482A1Merchandise Recommendation System, Method and Non-Transitory Computer Readable Storage Medium of the Same for Multiple UsersINST INFORMATION INDUSTRY·Filed 2013·Application pending·0 cites
- 2748US2015303368A1Method of repairing defect in superconducting film, method of coating superconducting film, and superconducting film formed by the methodIND TECH RES INST·Filed 2014·Application pending·0 cites
- 2847US2017162731A1Photovoltaic moduleIND TECH RES INST·Filed 2015·Application pending·0 cites
- 2940US2017215350A1Open plant cultivation device and method for preparing the sameORCHID GENE LLC·Filed 2016·Application pending·0 cites
- 3039US6130146AIn-situ nitride and oxynitride deposition process in the same chamberVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Oct 10, 2000·7 cites·14 claims
- 3137US2012052820A1Mobile Electronic Device and Data Process System Utilizing the SameLIN HSIEN-CHANG·Filed 2011·Application pending·0 cites
- 3235US6774488B2Low leakage and low resistance for memory and the manufacturing method for the plugsWINBOND ELECTRONICS CORP·Filed 2001·Granted Aug 10, 2004·0 cites·2 claims
- 3328US9529034B2Real-time insulation detector for feeding high-frequency low-voltage signal of power systemCHEN HSI-CHUAN·Filed 2014·Granted Dec 27, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →