Inventor · disambiguated record
Ping Kwong Seto
Also filed as: SETO PING KWONG
6 granted patents·543 citations·filing 1995–2000
88Inventor score
Technology areasH10W
Files withIBM6
Top patents by PatentIndex Score
6 records- 0196US5744863AChip carrier modules with heat sinks attached by flexible-epoxyIBM·Filed 1995·Granted Apr 28, 1998·243 cites·34 claims
- 0295US5672548AMethod for attaching heat sinks directly to chip carrier modules using flexible-epoxyIBM·Filed 1996·Granted Sep 30, 1997·191 cites·36 claims
- 0385US5785799AApparatus for attaching heat sinks directly to chip carrier modules using flexible epoxyIBM·Filed 1997·Granted Jul 28, 1998·65 cites·4 claims
- 0475US6545229B1Method for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 2000·Granted Apr 8, 2003·20 cites·6 claims
- 0554US5742483AMethod for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 1996·Granted Apr 21, 1998·17 cites·6 claims
- 0638US6167615B1Method for producing circuit board assemblies using surface mount components with finely spaced leadsIBM·Filed 1998·Granted Jan 2, 2001·7 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Ping Kwong Seto files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →