Inventor · disambiguated record
Sigeki Sekine
Also filed as: SEKINE SIGEKI
3 granted patents·132 citations·filing 1993–1995
76Inventor score
Technology areasH10W
Files withHITACHI LTD3
Top patents by PatentIndex Score
3 records- 0183US5621243ASemiconductor device having thermal stress resistance structureHITACHI LTD·Filed 1994·Granted Apr 15, 1997·80 cites·32 claims
- 0262US5446318ASemiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangementHITACHI LTD·Filed 1993·Granted Aug 29, 1995·29 cites·26 claims
- 0359US5585672ASemiconductor module with an improved heat sink/insulation plate arrangementHITACHI LTD·Filed 1995·Granted Dec 17, 1996·23 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →