Inventor · disambiguated record
Friedel Muller-Landau
Also filed as: MULLER-LANDAU FRIEDEL
2 granted patents·117 citations·filing 1991–1992
69Inventor score
Technology areasH10W
Files withIBM2
Top patents by PatentIndex Score
2 records- 0186US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0269US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →