Inventor · disambiguated record
Farid Youssif Aoude
Also filed as: AOUDE FARID Y · AOUDE FARID YOUSSIF
5 granted patents·167 citations·filing 1991–1999
83Inventor score
Technology areasH10W
Files withIBM5
Top patents by PatentIndex Score
5 records- 0186US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0274US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 0369US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 0450US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 0530US6358439B1Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1995·Granted Mar 19, 2002·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →