Inventor · disambiguated record
Homer H. Glascock, Ii
Also filed as: GLASCOCK HOMER · GLASCOCK II HOMER H · GLASCOCK JR HOMER H
31 granted patents·1,340 citations·filing 1975–1998
98Inventor score
Top patents by PatentIndex Score
31 records- 0198US4005330AElectrodeless fluorescent lampGEN ELECTRIC·Filed 1975·Granted Jan 25, 1977·86 cites·29 claims
- 0297US4117378AReflective coating for external core electrodeless fluorescent lampGEN ELECTRIC·Filed 1977·Granted Sep 26, 1978·60 cites·10 claims
- 0395US4361717AFluid cooled solar powered photovoltaic cellGEN ELECTRIC·Filed 1980·Granted Nov 30, 1982·117 cites·6 claims
- 0493US4392153ACooled semiconductor power module including structured strain buffers without dry interfacesGEN ELECTRIC·Filed 1978·Granted Jul 5, 1983·87 cites·23 claims
- 0591US4901136AMulti-chip interconnection packageGEN ELECTRIC·Filed 1988·Granted Feb 13, 1990·99 cites·15 claims
- 0691US4803450AMultilayer circuit board fabricated from siliconGEN ELECTRIC·Filed 1987·Granted Feb 7, 1989·73 cites·19 claims
- 0785US4939101AMethod of making direct bonded wafers having a void free interfaceGEN ELECTRIC·Filed 1988·Granted Jul 3, 1990·67 cites·23 claims
- 0885US4921415ACure monitoring apparatus having high temperature ultrasonic transducersGEN ELECTRIC·Filed 1988·Granted May 1, 1990·54 cites·1 claims
- 0985US4541035ALow loss, multilevel silicon circuit boardGEN ELECTRIC·Filed 1984·Granted Sep 10, 1985·57 cites·8 claims
- 1085US4366713AUltrasonic bond testing of semiconductor devicesGEN ELECTRIC·Filed 1981·Granted Jan 4, 1983·46 cites·10 claims
- 1183US5103290AHermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Apr 7, 1992·62 cites·42 claims
- 1283US4444352AMethod of thermo-compression diffusion bonding together metal surfacesGEN ELECTRIC·Filed 1981·Granted Apr 24, 1984·31 cites·29 claims
- 1380US5028987AHigh current hermetic package having a lead extending through the package lid and a packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Jul 2, 1991·52 cites·25 claims
- 1479US5166773AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1989·Granted Nov 24, 1992·50 cites·15 claims
- 1578US5100740ADirect bonded symmetric-metallic-laminate/substrate structuresGEN ELECTRIC·Filed 1991·Granted Mar 31, 1992·35 cites·25 claims
- 1678US4825117ATemperature compensated piezoelectric transducer assemblyGEN ELECTRIC·Filed 1987·Granted Apr 25, 1989·37 cites·3 claims
- 1776US6060795ASemiconductor power packINTERSIL CORP·Filed 1998·Granted May 9, 2000·60 cites·89 claims
- 1875US5105536AMethod of packaging a semiconductor chip in a low inductance packageGEN ELECTRIC·Filed 1991·Granted Apr 21, 1992·51 cites·4 claims
- 1974US5135890AMethod of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1991·Granted Aug 4, 1992·49 cites·6 claims
- 2058US5446316AHermetic package for a high power semiconductor deviceHARRIS CORP·Filed 1994·Granted Aug 29, 1995·23 cites·9 claims
- 2156US5206186AMethod for forming semiconductor electrical contacts using metal foil and thermocompression bondingGEN ELECTRIC·Filed 1992·Granted Apr 27, 1993·24 cites·7 claims
- 2254US5577656AMethod of packaging a semiconductor deviceHARRIS CORP·Filed 1995·Granted Nov 26, 1996·17 cites·9 claims
- 2353US4828597AFlexible glass fiber mat bonding methodGEN ELECTRIC·Filed 1987·Granted May 9, 1989·19 cites·14 claims
- 2451US5209390AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1992·Granted May 11, 1993·18 cites·5 claims
- 2549US4574299AThyristor packaging systemGEN ELECTRIC·Filed 1983·Granted Mar 4, 1986·13 cites·19 claims
- 2646US4745455ASilicon packages for power semiconductor devicesGEN ELECTRIC·Filed 1986·Granted May 17, 1988·16 cites·45 claims
- 2741US5184206ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1990·Granted Feb 2, 1993·12 cites·9 claims
- 2837US5473193APackage for parallel subelement semiconductor devicesHARRIS CORP·Filed 1994·Granted Dec 5, 1995·8 cites·7 claims
- 2935US5133795AMethod of making a silicon package for a power semiconductor deviceGEN ELECTRIC·Filed 1991·Granted Jul 28, 1992·6 cites·10 claims
- 3035US5034044AMethod of bonding a silicon package for a power semiconductor deviceGEN ELECTRIC·Filed 1989·Granted Jul 23, 1991·6 cites·13 claims
- 3134US5304847ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1993·Granted Apr 19, 1994·5 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →