Inventor · disambiguated record
Karl M. Robinson
Also filed as: ROBINSON KARL · ROBINSON KARL E · ROBINSON KARL M
122 granted patents·11 pending applications·6,171 citations·filing 1995–2024
99Inventor score
Top patents by PatentIndex Score
133 records- 0199US11246032B1Device provisioning and authenticationMOTIONAL AD LLC·Filed 2020·Granted Feb 8, 2022·16 cites·27 claims
- 0299US6361417B2Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 26, 2002·141 cites·86 claims
- 0399US6331139B2Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 18, 2001·95 cites·17 claims
- 0499US5616069ADirectional spray pad scrubberMICRON TECHNOLOGY INC·Filed 1995·Granted Apr 1, 1997·195 cites·15 claims
- 0598US6254460B1Fixed abrasive polishing padMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 3, 2001·65 cites·20 claims
- 0698US5779522ADirectional spray pad scrubberMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 14, 1998·125 cites·32 claims
- 0798US5725417AMethod and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substratesMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 10, 1998·234 cites·56 claims
- 0898US5624303APolishing pad and a method for making a polishing pad with covalently bonded particlesMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 29, 1997·240 cites·27 claims
- 0997US6402884B1Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 11, 2002·94 cites·19 claims
- 1097US6325702B2Method and apparatus for increasing chemical-mechanical-polishing selectivityMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 4, 2001·85 cites·40 claims
- 1197US6273800B1Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·133 cites·15 claims
- 1297US6191037B1Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 20, 2001·185 cites·27 claims
- 1397US5919082AFixed abrasive polishing padMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 6, 1999·118 cites·29 claims
- 1497US5879222AAbrasive polishing pad with covalently bonded abrasive particlesMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 9, 1999·130 cites·80 claims
- 1597US5879226AMethod for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 9, 1999·150 cites·30 claims
- 1697US5868896AChemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 9, 1999·236 cites·19 claims
- 1797US5792709AHigh-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 11, 1998·185 cites·12 claims
- 1897US5733176APolishing pad and method of useMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 31, 1998·185 cites·62 claims
- 1996US6203407B1Method and apparatus for increasing-chemical-polishing selectivityMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 20, 2001·153 cites·20 claims
- 2096US6136043APolishing pad methods of manufacture and useMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 24, 2000·107 cites·29 claims
- 2196US6090475APolishing pad, methods of manufacturing and useMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 18, 2000·139 cites·54 claims
- 2296US6046111AMethod and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 4, 2000·162 cites·71 claims
- 2396US5893754AMethod for chemical-mechanical planarization of stop-on-feature semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 13, 1999·188 cites·26 claims
- 2496US5882248AApparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 16, 1999·193 cites·27 claims
- 2595US10661304B2Microfluidic control surfaces using ordered nanotube fabricsNANTERO INC·Filed 2017·Granted May 26, 2020·8 cites·15 claims
- 2695US7276446B2Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·63 cites·8 claims
- 2795US6290579B1Fixed abrasive polishing padMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 18, 2001·34 cites·11 claims
- 2895US5990012AChemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing padsMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·114 cites·39 claims
- 2995US5658190AApparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 19, 1997·179 cites·6 claims
- 3094US6238270B1Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted May 29, 2001·97 cites·20 claims
- 3194US6174780B1Method of preparing integrated circuit devices containing isolated dielectric materialMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 16, 2001·91 cites·13 claims
- 3294US6143123AChemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 7, 2000·139 cites·21 claims
- 3394US5981396AMethod for chemical-mechanical planarization of stop-on-feature semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 9, 1999·139 cites·12 claims
- 3494US5830806AWafer backing member for mechanical and chemical-mechanical planarization of substratesMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 3, 1998·157 cites·50 claims
- 3593US5823855APolishing pad and a method for making a polishing pad with covalently bonded particlesMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 20, 1998·86 cites·25 claims
- 3692US5938801APolishing pad and a method for making a polishing pad with covalently bonded particlesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 17, 1999·138 cites·33 claims
- 3791US6326303B1Copper electroless deposition on a titanium-containing surfaceMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 4, 2001·43 cites·8 claims
- 3891US6060395APlanarization method using a slurry including a dispersantMICRON TECHNOLOGY INC·Filed 1998·Granted May 9, 2000·98 cites·9 claims
- 3990US6409586B2Fixed abrasive polishing padMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 25, 2002·45 cites·36 claims
- 4090US6124207ASlurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurriesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·94 cites·36 claims
- 4189US5827781APlanarization slurry including a dispersant and method of using sameMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 27, 1998·82 cites·25 claims
- 4288US5834358AIsolation regions and methods of forming isolation regionsMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 10, 1998·71 cites·9 claims
- 4387US11535112B2Managing power of electronic devices on a vehicleMOTIONAL AD LLC·Filed 2020·Granted Dec 27, 2022·2 cites·15 claims
- 4487US6455916B1Integrated circuit devices containing isolated dielectric materialMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 24, 2002·53 cites·37 claims
- 4587US6277015B1Polishing pad and systemMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 21, 2001·52 cites·35 claims
- 4687US6126989ACopper electroless deposition on a titanium-containing surfaceMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 3, 2000·62 cites·20 claims
- 4786US6224466B1Methods of polishing materials, methods of slowing a rate of material removal of a polishing processMICRON TECHNOLOGY INC·Filed 1998·Granted May 1, 2001·66 cites·17 claims
- 4886US6054172ACopper electroless deposition on a titanium-containing surfaceMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 25, 2000·58 cites·16 claims
- 4984US9422651B2Methods for arranging nanoscopic elements within networks, fabrics, and filmsROBERTS DAVID A·Filed 2011·Granted Aug 23, 2016·5 cites·37 claims
- 5084US5645737AWet clean for a surface having an exposed silicon/silica interfaceMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 8, 1997·54 cites·23 claims
Showing the top 50 of 133 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →