Inventor · disambiguated record
Jung-Seok Ahn
Also filed as: AHN JUNG-SEOK
8 granted patents·4 pending applications·50 citations·filing 2012–2023
85Inventor score
Top patents by PatentIndex Score
12 records- 0191US9412707B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·19 claims
- 0289US10157766B2Method of fabricating a semiconductor deviceKANG UN BYOUNG·Filed 2014·Granted Dec 18, 2018·13 cites·19 claims
- 0388US9023716B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 5, 2015·8 cites·19 claims
- 0486US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 0581US9006081B2Methods of processing substratesAHN JUNG-SEOK·Filed 2012·Granted Apr 14, 2015·6 cites·8 claims
- 0676US9412636B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·2 cites·20 claims
- 0773US10748875B2Apparatus of semiconductor memory and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 0870US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 0953US2013181343A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1049US2015318268A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1146US2024014087A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1234US2015221517A1Method of manufacturing semiconductoe deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →