Inventor · disambiguated record
Yuzo Shimada
Also filed as: SHIMADA YUZO
44 granted patents·6 pending applications·1,705 citations·filing 1982–2005
99Inventor score
Top patents by PatentIndex Score
50 records- 0194US6524905B2Semiconductor device, and thin film capacitorNEC CORP·Filed 2001·Granted Feb 25, 2003·76 cites·7 claims
- 0294US6188127B1Semiconductor packing stack module and method of producing the sameNEC CORP·Filed 1996·Granted Feb 13, 2001·226 cites·12 claims
- 0393US5978231APrinted wiring board with integrated coil inductorNEC CORP·Filed 1998·Granted Nov 2, 1999·102 cites·20 claims
- 0492US4567542AMultilayer ceramic substrate with interlayered capacitorNEC CORP·Filed 1984·Granted Jan 28, 1986·69 cites·7 claims
- 0591US6477284B1Photo-electric combined substrate, optical waveguide and manufacturing process thereforNEC CORP·Filed 2000·Granted Nov 5, 2002·61 cites·11 claims
- 0691US5830563AInterconnection structures and method of making sameNEC CORP·Filed 1996·Granted Nov 3, 1998·85 cites·9 claims
- 0790US6515324B2Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing sameNEC CORP·Filed 2001·Granted Feb 4, 2003·59 cites·22 claims
- 0890US5973392AStacked carrier three-dimensional memory module and semiconductor device using the sameNEC CORP·Filed 1998·Granted Oct 26, 1999·154 cites·16 claims
- 0988US6111479ALaminate printed circuit board with a magnetic layerNEC CORP·Filed 1998·Granted Aug 29, 2000·69 cites·32 claims
- 1087US6670699B2Semiconductor device packaging structureNEC CORP·Filed 2002·Granted Dec 30, 2003·48 cites·23 claims
- 1185US4536435AMultilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic materialNIPPON ELECTRIC CO·Filed 1982·Granted Aug 20, 1985·59 cites·5 claims
- 1284US6703705B2Semiconductor device and method for packaging sameNEC CORP·Filed 2001·Granted Mar 9, 2004·31 cites·19 claims
- 1382US6130111APackaged semiconductor device and method of manufacturing the sameNEC CORP·Filed 1999·Granted Oct 10, 2000·57 cites·2 claims
- 1481US6934429B2Optical waveguide board and optical moduleNEC CORP·Filed 2002·Granted Aug 23, 2005·23 cites·16 claims
- 1581US6087597AConnecting member and a connecting method with ball and tapered viaNEC CORP·Filed 1995·Granted Jul 11, 2000·64 cites·17 claims
- 1681US4724283AMulti-layer circuit board having a large heat dissipationNEC CORP·Filed 1986·Granted Feb 9, 1988·56 cites·7 claims
- 1780US4574255AMMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrateNEC CORP·Filed 1983·Granted Mar 4, 1986·45 cites·37 claims
- 1879US5952712APackaged semiconductor device and method of manufacturing the sameNEC CORP·Filed 1997·Granted Sep 14, 1999·49 cites·13 claims
- 1979US5793117ASemiconductor device and method of fabricating the sameNEC CORP·Filed 1996·Granted Aug 11, 1998·58 cites·25 claims
- 2072US6926188B2Transfer apparatus for arraying small conductive bumps on a substrate and/ or chipJAPAN E M CO LTD·Filed 2003·Granted Aug 9, 2005·15 cites·9 claims
- 2171US6095398ASolder ball arrangement deviceNEC CORP·Filed 1998·Granted Aug 1, 2000·25 cites·14 claims
- 2270US6829079B2Optical path control apparatus with mirror section, and manufacturing method for the sameNEC CORP·Filed 2001·Granted Dec 7, 2004·12 cites·7 claims
- 2370US5976965AMethod for arranging minute metallic ballsNEC CORP·Filed 1998·Granted Nov 2, 1999·35 cites·7 claims
- 2469US6422452B2Method and apparatus for lining up micro-ballsJAPAN EM KK·Filed 2001·Granted Jul 23, 2002·15 cites·11 claims
- 2568US5838064ASupporting member for cooling means and electronic package using the sameNEC CORP·Filed 1995·Granted Nov 17, 1998·31 cites·29 claims
- 2667US6889886B2Transfer apparatus for arraying small conductive bumps on substrate and/ or chipJAPAN E M CO LTD·Filed 2002·Granted May 10, 2005·12 cites·30 claims
- 2761US5699610AProcess for connecting electronic devicesNEC CORP·Filed 1995·Granted Dec 23, 1997·27 cites·14 claims
- 2857US5814882ASeal structure for tape carrier packageNEC CORP·Filed 1995·Granted Sep 29, 1998·22 cites·20 claims
- 2955US6999643B2Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring boardNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Feb 14, 2006·4 cites·19 claims
- 3055US6486540B2Three-dimensional semiconductor device and method of manufacturing the sameNEC CORP·Filed 2001·Granted Nov 26, 2002·6 cites·28 claims
- 3155US6430327B1Optical module and manufacturing method thereofNEC CORP·Filed 2000·Granted Aug 6, 2002·4 cites·14 claims
- 3253US6949815B2Semiconductor device with decoupling capacitors mounted on conductorsNEC CORP·Filed 2003·Granted Sep 27, 2005·4 cites·3 claims
- 3352US6378756B1Solder ball arrangement deviceNEC CORP·Filed 2000·Granted Apr 30, 2002·3 cites·4 claims
- 3451US5814535ASupporting member for cooling means, electronic package and method of making the sameNEC CORP·Filed 1995·Granted Sep 29, 1998·14 cites·6 claims
- 3549US5292574ACeramic substrate having wiring of silver seriesNEC CORP·Filed 1991·Granted Mar 8, 1994·17 cites·8 claims
- 3649US5283081AProcess for manufacturing a ceramic wiring substrate having a low dielectric constantNEC CORP·Filed 1992·Granted Feb 1, 1994·18 cites·12 claims
- 3747US7263897B2Three-axis motion tableUNIV NIHON·Filed 2004·Granted Sep 4, 2007·1 cites·1 claims
- 3846US5936845AIC package and IC probe card with organic substrateNEC CORP·Filed 1997·Granted Aug 10, 1999·13 cites·16 claims
- 3942US5923535AElectronic device assemblyNEC CORP·Filed 1997·Granted Jul 13, 1999·10 cites·3 claims
- 4042US2009250453A1Electric conduction heating deviceNIPPON CRUCIBLE CO·Filed 2005·Application pending·0 cites
- 4140US5753376AMultilayer glass ceramic substrate and process for producing the sameNEC CORP·Filed 1997·Granted May 19, 1998·7 cites·3 claims
- 4239US5283210ALow temperature sintering low dielectric inorganic compositionNEC CORP·Filed 1992·Granted Feb 1, 1994·9 cites·13 claims
- 4339US2003053765A1Photo-electric combined substrateNEC CORP·Filed 2002·Application pending·0 cites
- 4437US6096259AFabrication method of plastic-molded lead componentNEC CORP·Filed 1997·Granted Aug 1, 2000·6 cites·9 claims
- 4536US2002017700A1Multilayer capacitor, semiconductor device, and electrical circuit boardNEC CORP·Filed 2001·Application pending·0 cites
- 4636US2001054762A1Semiconductor device and method of fabricating the sameNEC CORP·Filed 2001·Application pending·0 cites
- 4736US2002056922A1Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied theretoNEC CORP·Filed 2001·Application pending·0 cites
- 4835US5989484AMultilayer glass ceramic substrate and process for producing the sameNEC CORP·Filed 1997·Granted Nov 23, 1999·4 cites·8 claims
- 4933US7106426B2Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalkNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Sep 12, 2006·0 cites·4 claims
- 5033US2001015372A1Apparatus for transferring micro-ballsE M CO LTD·Filed 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →