Inventor · disambiguated record
Wayne J. Howell
Also filed as: HOWELL WAYNE · HOWELL WAYNE J · HOWELL WAYNE JOHN
67 granted patents·6 pending applications·6,039 citations·filing 1993–2023
99Inventor score
Top patents by PatentIndex Score
73 records- 0199US5977640AHighly integrated chip-on-chip packagingIBM·Filed 1998·Granted Nov 2, 1999·585 cites·13 claims
- 0299US5502333ASemiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuitIBM·Filed 1994·Granted Mar 26, 1996·389 cites·25 claims
- 0398US6358627B2Rolling ball connectorIBM·Filed 2001·Granted Mar 19, 2002·164 cites·7 claims
- 0497US6410431B2Through-chip conductors for low inductance chip-to-chip integration and off-chip connectionsIBM·Filed 2000·Granted Jun 25, 2002·127 cites·6 claims
- 0597US6271102B1Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 1998·Granted Aug 7, 2001·125 cites·11 claims
- 0697US5561622AIntegrated memory cube structureIBM·Filed 1993·Granted Oct 1, 1996·250 cites·29 claims
- 0796US6265771B1Dual chip with heat sinkIBM·Filed 1999·Granted Jul 24, 2001·209 cites·6 claims
- 0896US5926029AUltra fine probe contactsIBM·Filed 1997·Granted Jul 20, 1999·151 cites·11 claims
- 0996US5691248AMethods for precise definition of integrated circuit chip edgesIBM·Filed 1995·Granted Nov 25, 1997·232 cites·23 claims
- 1096US5571754AMethod of fabrication of endcap chip with conductive, monolithic L-connect for multichip stackIBM·Filed 1995·Granted Nov 5, 1996·191 cites·10 claims
- 1196US5563086AIntegrated memory cube, structure and fabricationIBM·Filed 1995·Granted Oct 8, 1996·195 cites·14 claims
- 1296US5502667AIntegrated multichip memory module structureIBM·Filed 1993·Granted Mar 26, 1996·291 cites·26 claims
- 1395US6233184B1Structures for wafer level test and burn-inIBM·Filed 1998·Granted May 15, 2001·102 cites·44 claims
- 1495US5567654AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1994·Granted Oct 22, 1996·150 cites·56 claims
- 1594US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 1694US5702984AIntegrated mulitchip memory module, structure and fabricationIBM·Filed 1996·Granted Dec 30, 1997·163 cites·20 claims
- 1794US5648684AEndcap chip with conductive, monolithic L-connect for multichip stackIBM·Filed 1995·Granted Jul 15, 1997·143 cites·20 claims
- 1894US5478781APolyimide-insulated cube package of stacked semiconductor device chipsIBM·Filed 1994·Granted Dec 26, 1995·174 cites·36 claims
- 1994US5466634AElectronic modules with interconnected surface metallization layers and fabrication methods thereforeIBM·Filed 1994·Granted Nov 14, 1995·153 cites·32 claims
- 2093US6611050B1Chip edge interconnect apparatus and methodIBM·Filed 2000·Granted Aug 26, 2003·79 cites·16 claims
- 2193US6294406B1Highly integrated chip-on-chip packagingIBM·Filed 1999·Granted Sep 25, 2001·120 cites·10 claims
- 2293US6177729B1Rolling ball connectorIBM·Filed 1999·Granted Jan 23, 2001·84 cites·23 claims
- 2393US5786628AMethod and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packagingIBM·Filed 1997·Granted Jul 28, 1998·127 cites·11 claims
- 2492US6444490B2Micro-flex technology in semiconductor packagesIBM·Filed 2001·Granted Sep 3, 2002·45 cites·11 claims
- 2592US6426904B2Structures for wafer level test and burn-inIBM·Filed 2001·Granted Jul 30, 2002·43 cites·30 claims
- 2692US5907178AMulti-view imaging apparatusIBM·Filed 1998·Granted May 25, 1999·108 cites·7 claims
- 2792US5869896APackaged electronic module and integral sensor arrayIBM·Filed 1998·Granted Feb 9, 1999·97 cites·7 claims
- 2891US5946545ASemiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuitIBM·Filed 1997·Granted Aug 31, 1999·98 cites·9 claims
- 2991US5719438AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1995·Granted Feb 17, 1998·97 cites·84 claims
- 3090US7394268B2Carrier for test, burn-in, and first level packagingIBM·Filed 2006·Granted Jul 1, 2008·13 cites·4 claims
- 3190US6225699B1Chip-on-chip interconnections of varied characteristicsIBM·Filed 1998·Granted May 1, 2001·98 cites·32 claims
- 3290US5517754AFabrication processes for monolithic electronic modulesIBM·Filed 1994·Granted May 21, 1996·98 cites·42 claims
- 3389US7132841B1Carrier for test, burn-in, and first level packagingIBM·Filed 2000·Granted Nov 7, 2006·37 cites·31 claims
- 3489US5925924AMethods for precise definition of integrated circuit chip edgesIBM·Filed 1997·Granted Jul 20, 1999·83 cites·4 claims
- 3588US6222276B1Through-chip conductors for low inductance chip-to-chip integration and off-chip connectionsIBM·Filed 1998·Granted Apr 24, 2001·82 cites·14 claims
- 3688US5517057AElectronic modules with interconnected surface metallization layersIBM·Filed 1995·Granted May 14, 1996·87 cites·19 claims
- 3785US5811868AIntegrated high-performance decoupling capacitorIBM·Filed 1996·Granted Sep 22, 1998·94 cites·19 claims
- 3883US6915795B2Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 2003·Granted Jul 12, 2005·20 cites·11 claims
- 3983US6806578B2Copper pad structureIBM·Filed 2000·Granted Oct 19, 2004·32 cites·21 claims
- 4082US6258627B1Underfill preform interposer for joining chip to substrateIBM·Filed 1999·Granted Jul 10, 2001·69 cites·50 claims
- 4182US5763943AElectronic modules with integral sensor arraysIBM·Filed 1996·Granted Jun 9, 1998·54 cites·5 claims
- 4280US6858941B2Multi-chip stack and method of fabrication utilizing self-aligning electrical contact arrayIBM·Filed 2000·Granted Feb 22, 2005·25 cites·18 claims
- 4380US5903045ASelf-aligned connector for stacked chip moduleIBM·Filed 1996·Granted May 11, 1999·51 cites·27 claims
- 4479US5923181AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1997·Granted Jul 13, 1999·41 cites·7 claims
- 4576US6426241B1Method for forming three-dimensional circuitization and circuits formedIBM·Filed 1999·Granted Jul 30, 2002·39 cites·44 claims
- 4675US6642080B1Chip-on-chip interconnections of varied charactersticsIBM·Filed 2000·Granted Nov 4, 2003·18 cites·21 claims
- 4775US6300687B1Micro-flex technology in semiconductor packagesIBM·Filed 1998·Granted Oct 9, 2001·28 cites·32 claims
- 4873US5596226ASemiconductor chip having a chip metal layer and a transfer metal and corresponding electronic moduleIBM·Filed 1994·Granted Jan 21, 1997·32 cites·2 claims
- 4971US6645789B2On chip alpha-particle detectorIBM·Filed 2002·Granted Nov 11, 2003·12 cites·8 claims
- 5071US5686843AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1995·Granted Nov 11, 1997·30 cites·29 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →