Inventor · disambiguated record
Tsuyoshi Tokiwa
Also filed as: TOKIWA TSUYOSHI
8 granted patents·187 citations·filing 1999–2020
87Inventor score
Top patents by PatentIndex Score
8 records- 0187US6646330B2Lead frame for semiconductor device, process for producing the same and semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 11, 2003·58 cites·8 claims
- 0283US6395583B1Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 28, 2002·40 cites·13 claims
- 0383US6087714ASemiconductor devices having tin-based solder film containing no lead and process for producing the devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 11, 2000·74 cites·6 claims
- 0478US8679370B2Conductive coating, method for preparing a coating, roller, and method for manufacturing a roller and using a coatingTEN CATE ENBI INTERNAT B V·Filed 2013·Granted Mar 25, 2014·2 cites·18 claims
- 0565US7962077B2Developing roller, developing apparatus comprising the developing roller, and method for providing the developing rollerTEN CATE ENBI INTERNAT B V·Filed 2009·Granted Jun 14, 2011·2 cites·9 claims
- 0664US8419977B2Conductive coating, method for preparing a coating, roller, and method for manufacturing a roller and using a coatingJANSEN JOHN·Filed 2009·Granted Apr 16, 2013·1 cites·21 claims
- 0760US6575354B2Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 10, 2003·10 cites·19 claims
- 0850US11462525B2Optical coupling device and high frequency deviceTOSHIBA KK·Filed 2020·Granted Oct 4, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →