Inventor · disambiguated record
Gregory M. Chrysler
Also filed as: CHRYSLER GREGORY · CHRYSLER GREGORY M · CHRYSLER GREGORY MARTIN
102 granted patents·21 pending applications·3,172 citations·filing 1986–2013
99Inventor score
Top patents by PatentIndex Score
123 records- 0198US7795711B2Microelectronic cooling apparatus and associated methodINTEL CORP·Filed 2005·Granted Sep 14, 2010·80 cites·23 claims
- 0298US6213194B1Hybrid cooling system for electronics moduleIBM·Filed 1999·Granted Apr 10, 2001·152 cites·11 claims
- 0397US6845622B2Phase-change refrigeration apparatus with thermoelectric cooling element and methodsINTEL CORP·Filed 2003·Granted Jan 25, 2005·92 cites·26 claims
- 0496US7336487B1Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolantINTEL CORP·Filed 2006·Granted Feb 26, 2008·50 cites·31 claims
- 0596US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 0696US7031155B2Electronic thermal managementINTEL CORP·Filed 2003·Granted Apr 18, 2006·119 cites·19 claims
- 0796US6992382B2Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline siliconINTEL CORP·Filed 2003·Granted Jan 31, 2006·122 cites·17 claims
- 0896US6650542B1Piezoelectric actuated jet impingement coolingINTEL CORP·Filed 2003·Granted Nov 18, 2003·116 cites·16 claims
- 0996US4765397AImmersion cooled circuit module with improved finsIBM·Filed 1986·Granted Aug 23, 1988·208 cites·1 claims
- 1095US7435623B2Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline siliconINTEL CORP·Filed 2005·Granted Oct 14, 2008·38 cites·4 claims
- 1194US6706562B2Electronic assembly with high capacity thermal spreader and methods of manufactureINTEL CORP·Filed 2001·Granted Mar 16, 2004·71 cites·23 claims
- 1294US6653730B2Electronic assembly with high capacity thermal interfaceINTEL CORP·Filed 2000·Granted Nov 25, 2003·83 cites·55 claims
- 1394US5761037AOrientation independent evaporatorIBM·Filed 1996·Granted Jun 2, 1998·182 cites·12 claims
- 1492US8164169B2Cooling devices in semiconductor packagesCHRYSLER GREGORY M·Filed 2010·Granted Apr 24, 2012·21 cites·22 claims
- 1592US7851905B2Microelectronic package and method of cooling an interconnect feature in sameINTEL CORP·Filed 2007·Granted Dec 14, 2010·40 cites·16 claims
- 1692US6981380B2Thermoelectric cooling for microelectronic packages and diceINTEL CORP·Filed 2002·Granted Jan 3, 2006·51 cites·19 claims
- 1792US6661660B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2001·Granted Dec 9, 2003·72 cites·17 claims
- 1891US7550901B2Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using sameINTEL CORP·Filed 2007·Granted Jun 23, 2009·21 cites·17 claims
- 1991US6639799B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2000·Granted Oct 28, 2003·67 cites·8 claims
- 2091US5482113AConvertible heat exchanger for air or water cooling of electronic circuit components and the likeIBM·Filed 1993·Granted Jan 9, 1996·80 cites·10 claims
- 2190US7348665B2Liquid metal thermal interface for an integrated circuit deviceINTEL CORP·Filed 2004·Granted Mar 25, 2008·54 cites·22 claims
- 2290US5370178AConvertible cooling module for air or water cooling of electronic circuit componentsIBM·Filed 1993·Granted Dec 6, 1994·130 cites·13 claims
- 2390US5303555AElectronics package with improved thermal management by thermoacoustic heat pumpingIBM·Filed 1992·Granted Apr 19, 1994·132 cites·19 claims
- 2489US6785134B2Embedded liquid pump and microchannel cooling systemINTEL CORP·Filed 2003·Granted Aug 31, 2004·54 cites·16 claims
- 2589US6646874B2Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking stationINTEL CORP·Filed 2001·Granted Nov 11, 2003·64 cites·21 claims
- 2689US5953930AEvaporator for use in an extended air cooling system for electronic componentsIBM·Filed 1998·Granted Sep 21, 1999·104 cites·6 claims
- 2788US7362580B2Electronic assembly having an indium wetting layer on a thermally conductive bodyINTEL CORP·Filed 2004·Granted Apr 22, 2008·41 cites·20 claims
- 2885US7911052B2Nanotube based vapor chamber for die level coolingINTEL CORP·Filed 2007·Granted Mar 22, 2011·11 cites·20 claims
- 2985US6549407B1Heat exchanger retention mechanismINTEL CORP·Filed 2001·Granted Apr 15, 2003·40 cites·21 claims
- 3084US8313282B1Compact air-plus-liquid thermal management moduleJARRAH YOUSEF·Filed 2009·Granted Nov 20, 2012·19 cites·19 claims
- 3184US7335983B2Carbon nanotube micro-chimney and thermo siphon die-level coolingINTEL CORP·Filed 2005·Granted Feb 26, 2008·10 cites·18 claims
- 3284US6223810B1Extended air cooling with heat loop for dense or compact configurations of electronic componentsIBM·Filed 1998·Granted May 1, 2001·64 cites·14 claims
- 3383US7243705B2Integrated circuit coolant microchannel with compliant coverINTEL CORP·Filed 2005·Granted Jul 17, 2007·10 cites·2 claims
- 3483US7012011B2Wafer-level diamond spreaderINTEL CORP·Filed 2004·Granted Mar 14, 2006·23 cites·11 claims
- 3582US7367195B2Application and removal of thermal interface materialINTEL CORP·Filed 2006·Granted May 6, 2008·8 cites·20 claims
- 3682US7170098B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2005·Granted Jan 30, 2007·8 cites·6 claims
- 3782US7063268B2Electro-active fluid cooling systemINTEL CORP·Filed 2004·Granted Jun 20, 2006·26 cites·24 claims
- 3881US7915081B2Flexible interconnect pattern on semiconductor packageINTEL CORP·Filed 2006·Granted Mar 29, 2011·9 cites·11 claims
- 3981US6609561B2Tunnel-phase change heat exchangerINTEL CORP·Filed 2001·Granted Aug 26, 2003·29 cites·26 claims
- 4080US7508671B2Computer system having controlled coolingINTEL CORP·Filed 2003·Granted Mar 24, 2009·28 cites·3 claims
- 4180US6770966B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2001·Granted Aug 3, 2004·21 cites·10 claims
- 4279US7633753B2Piezoelectric air jet augmented cooling for electronic devicesINTEL CORP·Filed 2007·Granted Dec 15, 2009·7 cites·19 claims
- 4379US7471515B2Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachmentINTEL CORP·Filed 2007·Granted Dec 30, 2008·7 cites·5 claims
- 4479US7457116B2Method and system to cool memoryINTEL CORP·Filed 2006·Granted Nov 25, 2008·9 cites·18 claims
- 4578US7218519B2Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channelsINTEL CORP·Filed 2004·Granted May 15, 2007·24 cites·28 claims
- 4677US7779638B2Localized microelectronic cooling apparatuses and associated methods and systemsINTEL CORP·Filed 2005·Granted Aug 24, 2010·5 cites·23 claims
- 4775US8006747B2Micro-chimney and thermosiphon die-level coolingINTEL CORP·Filed 2009·Granted Aug 30, 2011·4 cites·7 claims
- 4875US7557438B2Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing sameINTEL CORP·Filed 2006·Granted Jul 7, 2009·6 cites·26 claims
- 4975US7545030B2Article having metal impregnated within carbon nanotube arrayINTEL CORP·Filed 2005·Granted Jun 9, 2009·10 cites·26 claims
- 5075US7487822B2Micro-chimney and thermosiphon die-level coolingINTEL CORP·Filed 2005·Granted Feb 10, 2009·4 cites·22 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →